Paper
19 May 2008 Advanced mask data processing for 32nm and beyond
John Nogatch, Dan Hung, Raghava Kondepudy, Johnny Yeap
Author Affiliations +
Abstract
Smaller feature sizes and aggressive Reticle Enhancement Techniques have led to greatly increased mask data file sizes, longer processing times, and shrinking error budgets. Improvements to Mask Data Preparation software can mitigate these trends. Processing time can be reduced by using algorithms which are compatible with scalable multi-core Distributed Processing. Increased pattern uniformity in the fractured output can reduce Critical Dimension variation on the finished mask plate. Procedures for estimating pattern uniformity and CD variation are described.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John Nogatch, Dan Hung, Raghava Kondepudy, and Johnny Yeap "Advanced mask data processing for 32nm and beyond", Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 702833 (19 May 2008); https://doi.org/10.1117/12.793108
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KEYWORDS
Critical dimension metrology

Vestigial sideband modulation

Photomasks

Prototyping

Data processing

Error analysis

Visualization

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