Self-aligned double-patterning (SADP) friendly detailed routing

Minoo Mirsaeedi; J. Andres Torres; Mohab Anis

doi:10.1117/12.877601

4 April 2011 Self-aligned double-patterning (SADP) friendly detailed routing

Minoo Mirsaeedi, J. Andres Torres, Mohab Anis

Proceedings Volume 7974, Design for Manufacturability through Design-Process Integration V; 79740O (2011) https://doi.org/10.1117/12.877601
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

Amongst the possible double patterning strategies for sub 32nm processes, self-aligned double patterning (SADP) has moved from Flash-only processes to more general purpose devices. The reason is that while litho-etch- litho-etc (LELE) process was originally preferred due to its simplicity and relative low cost, its sensitivity to overlay error has prompted the search for other methods. Although the basic SADP process is fairly robust against the overlay error, the robustness of 2D SADP method strongly depends on layout and decomposition styles and decomposability compliance. In this paper, we first discuss different printability challenges for SADP method. Afterward, we propose a SADP-aware detailed routing method, by applying a correct-by-construction approach, to provide SADP-friendly layouts. This method performs detailed routing and layout decomposition concurrently to prevent litho-limited layout configurations. Experimental results show that, compared with a SADP-blind detailed router, the proposed method achieves considerable robustness against lithography imperfection in expense of tolerable wire length overhead.

Citation Download Citation

Minoo Mirsaeedi, J. Andres Torres, and Mohab Anis "Self-aligned double-patterning (SADP) friendly detailed routing", Proc. SPIE 7974, Design for Manufacturability through Design-Process Integration V, 79740O (4 April 2011); https://doi.org/10.1117/12.877601

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