Presentation
5 March 2022 Hybrid photonic integration for communication, sensing and quantum technology
Author Affiliations +
Abstract
Fraunhofer HHI's hybrid integration platform PolyBoard combines polymer passive waveguides with InP and other materials. We present new functionalities integrated in PolyBoard: Isolation: With a microoptical bench integrated into polymer isolators can be built. Quantum and sensing: By integrating nonlinear materials into the microoptical bench, 2nd (775 nm), 3rd (515 nm), and 4th (387 nm) harmonic generation could be observed 3D: First results for a 2x4 phased array have been achieved Flip-chip laser active alignment: We have developed an active alignment process, which also works for flip-chip lasers which are impossible to electrically contact during the alignment process. First automation results show the potential for cost effective volume scaling.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Martin Schell, Norbert Keil, Moritz Kleinert, David de Felipe, Crispin Zawadzki, Madeleine Weigel, Martin Kresse, Michael Theurer, Hauke Conradi, and Tianwen Qian "Hybrid photonic integration for communication, sensing and quantum technology", Proc. SPIE PC12004, Integrated Optics: Devices, Materials, and Technologies XXVI, PC1200407 (5 March 2022); https://doi.org/10.1117/12.2610737
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KEYWORDS
Quantum communications

Waveguides

Polymers

Laser optics

Optical isolators

Phased array optics

Photonic integrated circuits

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