3 September 2013 Specimen alignment of micro-tensile testing using vernier-groove carrier or specimen with piezoresistive cells
Duanqin Zhang, Jianxiu Liu, Le Guan, Jinkui Chu
Author Affiliations +
Abstract
Specimen alignment is critical for the accuracy and the reliability of micro-tensile testing. A vernier-groove carrier fabricated by bulk micromachining of silicon is developed. Through the vernier in the carrier the alignment accuracy can be detected, and the groove and the convex stands guarantee rapid alignment and high repeatability. In order to demonstrate the validity of the carrier, a micro-tensile specimen integrated with piezoresistive cells is designed. The specimen can detect axial alignment precision and tensile force simultaneously. The performances of the carrier and the specimen are tested by using a micro-tensile tester. By comparing the measured results of micro-tensile testing with the carrier and without the carrier, it is confirmed that high alignment precision and high repeatability can be obtained by the carrier. For the specimen, the sensitivity coefficient of the piezoresistive cells for tensile force measurement is equal to 0.017  mV/mN .
© 2013 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2013/$25.00 © 2013 SPIE
Duanqin Zhang, Jianxiu Liu, Le Guan, and Jinkui Chu "Specimen alignment of micro-tensile testing using vernier-groove carrier or specimen with piezoresistive cells," Journal of Micro/Nanolithography, MEMS, and MOEMS 12(3), 033017 (3 September 2013). https://doi.org/10.1117/1.JMM.12.3.033017
Published: 3 September 2013
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KEYWORDS
Optical alignment

Silicon

Etching

Photomicroscopy

Microscopes

Bulk micromachining

Micromachining

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