Dr. John H. Lau
at Unimicron Technology Corp
SPIE Involvement:
Author | Instructor
Publications (11)

Proceedings Article | 20 February 2008 Paper
Riko I Made, Chee Lip Gan, Chengkuo Lee, Li Ling Yan, Aibin Yu, Seung Wook Yoon, John H. Lau
Proceedings Volume 6884, 68840H (2008) https://doi.org/10.1117/12.762046
KEYWORDS: Silver, Indium, Interfaces, Wafer bonding, Diffusion, Gold, Solids, Semiconducting wafers, Metals, Packaging

Proceedings Article | 8 February 2008 Paper
Yi Yoon Chai, Jing Zhang, Pamidighantma Ramana, Guan Jie Yap, John Hon-Shing Lau
Proceedings Volume 6899, 68990U (2008) https://doi.org/10.1117/12.764294
KEYWORDS: Transceivers, Receivers, Transmitters, Optical amplifiers, Semiconductor lasers, Eye, CMOS technology, Fiber to the x, Passive optical networks, Packaging

Proceedings Article | 8 February 2008 Paper
Aibin Yu, Chengkuo Lee, Li Ling Yan, Qing Xin Zhang, Seung Uk Yoon, John H. Lau
Proceedings Volume 6887, 688707 (2008) https://doi.org/10.1117/12.762021
KEYWORDS: Semiconducting wafers, Micromirrors, Mirrors, Wafer bonding, Microelectromechanical systems, Packaging, Silver, Interfaces, Actuators, Finite element methods

Proceedings Article | 8 February 2008 Paper
John Lau, Ying Ying Lim, Teck Guan Lim, Gong Yue Tang, Chee Houe Khong, Xiaowu Zhang, Pamidighantam Ramana, Jing Zhang, Chee Wei Tan, Jayakrishnan Chandrappan, Joey Chai, Jing Li, Geri Tangdiongga, Dim Lee Kwong
Proceedings Volume 6899, 689907 (2008) https://doi.org/10.1117/12.764032
KEYWORDS: Vertical cavity surface emitting lasers, Waveguides, Copper, Optoelectronics, Polymer multimode waveguides, Polymers, Optical printed circuit boards, Multiplexers, Signal attenuation, Optoelectronic devices

Proceedings Article | 8 February 2008 Paper
Chee Wei Tan, Teck Guan Lim, Jing Li, Geri Endrio Tangdiongga, Yi Yoon Chai, Seiji Maruo, Pamidighantam Ramana, Seung Wook Yoon, John Lau
Proceedings Volume 6899, 68990N (2008) https://doi.org/10.1117/12.764242
KEYWORDS: Mirrors, Silicon, Single mode fibers, Optical components, Optical benches, Optics manufacturing, Optical alignment, Tolerancing, Semiconducting wafers, Optical fabrication

Showing 5 of 11 publications
Conference Committee Involvement (1)
Photonics Packaging, Integration, and Interconnects IX
26 January 2009 | San Jose, California, United States
Course Instructor
SC1316: Heterogeneous Integration of Electronic IC and Photonic IC (Co-Packaged Optics)
This course explains basic principles and applications of heterogeneous integration of a switch, Electronic IC (EIC) and Photonic IC (PIC) packaging or co-packaged optics (CPO). A primary goal of the course is to reveal the fundamental, design, materials, process, fabrication, and reliability of switch, EIC and PIC packaging. Examples are taken from 3D stacking of EIC on PIC, heterogeneous integration of EIC and PIC with fan-out chip-last wafer-level and flip-chip bonding method, to heterogeneous integration of EIC and PIC with through-silicon via (TSV)-interposer and fiber coupling method. Anyone who wants to answer questions such as, “how to build heterogeneous integration of switch, EIC and PIC package?”, “how to make heterogeneous integration of PIC and EIC and switch on glass substrate? “how to stack EIC on PIC?”, “how to make hybrid bonding?”, “how to make microbump?”, “how to make fan-out package?”, “how to do flip chip packaging?”, or “how to make TSV-interposer?” will benefit from taking this course.
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