Keun Hee Bai
Principal Engineer at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Conference Program Committee | Author
Publications (4)

Proceedings Article | 10 April 2024 Presentation
Proceedings Volume 12958, 1295803 (2024) https://doi.org/10.1117/12.3009115
KEYWORDS: Metals, Resistance, Optical lithography, Ions, Transmission electron microscopy, Plasma, Oxygen, Oxides, Oxidation, Nanostructures

Proceedings Article | 1 May 2023 Presentation + Paper
Proceedings Volume 12499, 1249903 (2023) https://doi.org/10.1117/12.2661320
KEYWORDS: Diffractive optical elements, Etching, Visualization, Algorithm development, Logic, Process engineering, Mathematical optimization, Design and modelling, Semiconductors, Semiconducting wafers

Proceedings Article | 1 May 2023 Poster + Paper
Proceedings Volume 12499, 124990J (2023) https://doi.org/10.1117/12.2657249
KEYWORDS: Etching, Ions, Optical lithography, Metals, Carbon, Logic, Polymers, Passivation, Transmission electron microscopy, Statistical analysis

Proceedings Article | 13 June 2022 Presentation
Shurong Liang, Amol Gupta, Steven Sherman, Kevin Anglin, Keun Hee Bai, Jong Chul Park
Proceedings Volume PC12056, PC1205602 (2022) https://doi.org/10.1117/12.2615043
KEYWORDS: Optical lithography, Extreme ultraviolet lithography, Stochastic processes, Chemistry

Conference Committee Involvement (6)
Advanced Etch Technology and Process Integration for Nanopatterning XIII
26 February 2024 | San Jose, California, United States
Advanced Etch Technology and Process Integration for Nanopatterning XII
28 February 2023 | San Jose, California, United States
Advanced Etch Technology and Process Integration for Nanopatterning XI
26 April 2022 | San Jose, California, United States
Advanced Etch Technology and Process Integration for Nanopatterning X
22 February 2021 | Online Only, California, United States
Advanced Etch Technology for Nanopatterning IX
25 February 2020 | San Jose, California, United States
Showing 5 of 6 Conference Committees
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