Mr. Matthias Kirstein Profile

Matthias Kirstein

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Proceedings Article | 30 August 2019 Presentation + Paper

A novel approach of copper-ceramic-joints manufactured by selective laser melting

Thomas Stoll, Matthias Kirstein, Joerg Franke

Proceedings Volume 11101, 1110109 (2019) https://doi.org/10.1117/12.2529422

KEYWORDS: Ceramics, Copper, Adhesives, Laser processing, Additive manufacturing, Manufacturing, Temperature metrology

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The processes of Additive Manufacturing (AM) are nowadays mostly used for mechanical and fluid components and have already made the transition from Rapid Prototyping (RP) to Rapid Manufacturing (RM). In the electronic industry however, mostly additive printing technologies are used to a large extent. This paper reveals a new process for the additive production of copper-ceramic composites using Selective Laser Melting (SLM). With this process, 3D metallizations can be produced on Al₂O₃ and spinel-like compounds, as known from Direct Copper Bonded (DBC) technology, can be formed by means of thermal post-treatments. Moreover, high adhesive strengths of up to 44 N/mm², determined with shear testing, can be reached. The technology of melting copper or copper based powder on ceramic substrates can be used for example for power electronic applications for high current capabilities due to the possibility of manufacturing thick 3D metallizations without the occurrence of warpages as known from the DBC technology. In this study, extensive parameter analysis have been conducted with respect to laser power, laser velocity, hatching distance as well as focus shifting. On the other hand, the substrate temperature during the printing process was varied and post thermal treatments were applied in order to fully densify the metallization as well as form reaction layers between the ceramic-metal interface.

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