Mr. Paweł Bortnowski Profile

Paweł Bortnowski

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Proceedings Article | 30 May 2022 Poster

Integrated photonic transmitter for mode division multiplexing system

Aleksandra Pasnikowska, Stanislaw Stopinski, Paweł Bortnowski, Krzysztof Anders, Ryszard Piramidowicz

Proceedings Volume PC12141, PC121410T (2022) https://doi.org/10.1117/12.2624528

KEYWORDS: Transmitters, Multiplexing, Integrated photonics, Wavelength division multiplexing, Receivers, Photonic integrated circuits, Multiplexers, Demultiplexers, Data transmission, Single mode fibers

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To increase the data capacity of the telecom systems, new technologies are needed, e.g., mode division multiplexing (MDM), based on the concept of utilizing different mode channels for transmitting the different information streams in the few mode fibers (FMFs). A typical MDM link is composed of a multi-channel transmitter, which generates signals for each spatial mode, a dedicated multiplexer which is used to excite appropriate spatial modes and to launch all of these into a few-mode fiber. A demultiplexer preceding a multi-channel receiver complements the picture of the basic MDM system. This work is focused on proposing a new solution for MDM transmitters, fully utilizing the potential of generic technology of InP-based integrated photonics. Photonic integrated circuits (PICs) offer the possibility of developing a new generation of compact, energy-efficient, and low-cost devices, with additional features of high reliability and ease of integrating the multiple transmitters on a single chip. For the integration of both active and passive optoelectronic elements, indium phosphide (InP) is the material of choice due to the direct band-gap and the possibility of light generation/amplification at the telecom wavelengths around 1.55 µm. The proposed design is discussed with respect to potential performance parameters and applicability in MDM systems. ACKNOWLEDGMENT This work has received partial support from the National Centre for Research and Development through project NMKM+ (TECHMATSTRATEG1/348438/16/NCBR/2018) and from the EU Horizon 2020 research and innovation programme under grant agreement No. 687777 (PICs4All).

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