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YuHeng Huang
at Nanjing Electronic Devices Institute
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Publications (1)
Proceedings Article | 17 April 2020 Paper
Thermal conductivity of SiN flims with different thicknesses by 3ω method
Proceedings Volume 11455, 1145509 (2020) https://doi.org/10.1117/12.2557726
KEYWORDS: Resistance, Thin films, Silicon, Plasma enhanced chemical vapor deposition, Thermal effects, Thermal modeling, Interfaces
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