High-power picosecond laser with 400W average power for large scale applications

Keming Du; Stephan Brüning; Arnold Gillner

doi:10.1117/12.915676

17 February 2012 High-power picosecond laser with 400W average power for large scale applications

Keming Du, Stephan Brüning, Arnold Gillner

Proceedings Volume 8244, Laser-based Micro- and Nanopackaging and Assembly VI; 82440P (2012) https://doi.org/10.1117/12.915676
Event: SPIE LASE, 2012, San Francisco, California, United States

Abstract

Laser processing is generally known for low thermal influence, precise energy processing and the possibility to ablate every type of material independent on hardness and vaporisation temperature. The use of ultra-short pulsed lasers offers new possibilities in the manufacturing of high end products with extra high processing qualities. For achieving a sufficient and economical processing speed, high average power is needed. To scale the power for industrial uses the picosecond laser system has been developed, which consists of a seeder, a preamplifier and an end amplifier. With the oscillator/amplifier system more than 400W average power and maximum pulse energy 1mJ was obtained. For study of high speed processing of large embossing metal roller two different ps laser systems have been integrated into a cylinder engraving machine. One of the ps lasers has an average power of 80W while the other has 300W. With this high power ps laser fluencies of up to 30 J/cm² at pulse repetition rates in the multi MHz range have been achieved. Different materials (Cu, Ni, Al, steel) have been explored for parameters like ablation rate per pulse, ablation geometry, surface roughness, influence of pulse overlap and number of loops. An enhanced ablation quality and an effective ablation rate of 4mm³/min have been achieved by using different scanning systems and an optimized processing strategy. The max. achieved volume rate is 20mm³/min.

Citation Download Citation

Keming Du, Stephan Brüning, and Arnold Gillner "High-power picosecond laser with 400W average power for large scale applications", Proc. SPIE 8244, Laser-based Micro- and Nanopackaging and Assembly VI, 82440P (17 February 2012); https://doi.org/10.1117/12.915676

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