Stacked multichip-module technology for high-performance intelligent transducers

Siebe Bouwstra

doi:10.1117/12.250712

17 September 1996 Stacked multichip-module technology for high-performance intelligent transducers

Siebe Bouwstra

Proceedings Volume 2882, Micromachined Devices and Components II; (1996) https://doi.org/10.1117/12.250712
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

The development of a technology platform for advanced modular integration of integrated circuits and micromechanical transducers in space constrained applications is presented. This includes the development of a technology for vertical feedtroughs based on the use of electrodepositable photoresist, and the development of a technology for interconnecting transducer chips and circuit chips using eutectic solder bump bonding. Different topologies are considered.

Citation Download Citation

Siebe Bouwstra "Stacked multichip-module technology for high-performance intelligent transducers", Proc. SPIE 2882, Micromachined Devices and Components II, (17 September 1996); https://doi.org/10.1117/12.250712

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