0.33 NA EUV systems for high-volume manufacturing

Peter Klomp; Roderik van Es; Stuart Young; Christophe Smeets

doi:10.1117/12.3014165

10 April 2024 0.33 NA EUV systems for high-volume manufacturing

Peter Klomp, Roderik van Es, Stuart Young, Christophe Smeets

Proceedings Volume PC12953, Optical and EUV Nanolithography XXXVII; PC129530O (2024) https://doi.org/10.1117/12.3014165
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

ASML NXE:3400 and NXE:3600D scanners are now commonly used for High Volume Manufacturing (HVM) of 7 nm to 3 nm logic devices as well as 10 nm class memory devices. In this paper we will share the latest performance of these systems, including excellent overlay, critical dimension (CD) control, stability, reliability, and high productivity Furthermore, we will describe the latest technology supporting the ASML roadmap for further improving cost of technology via increased productivity and share system qualification and performance data of the next HVM scanner, the NXE:3800E. Lastly the ASML NXE sustainability roadmap showing progress and steps towards a significant reduction in energy consumption per wafer exposure on NXE systems will be presented.

Conference Presentation

Citation Download Citation

Peter Klomp, Roderik van Es, Stuart Young, and Christophe Smeets "0.33 NA EUV systems for high-volume manufacturing", Proc. SPIE PC12953, Optical and EUV Nanolithography XXXVII, PC129530O (10 April 2024); https://doi.org/10.1117/12.3014165

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