PROCEEDINGS ARTICLE | March 7, 2014
Proc. SPIE. 8975, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
KEYWORDS: Staring arrays, Bolometers, Microelectromechanical systems, Mirrors, Sensors, Electrodes, Nickel, Dysprosium, Semiconducting wafers, Assembly equipment
In recent years, smart phone applications have both raised the pressure for cost and time to market reduction, and the
need for high performance MEMS devices. This trend has led the MEMS community to develop multi-die packaging of
different functionalities or multi-technology (i.e. wafer) approaches to fabricate and assemble devices respectively. This
paper reports on the fabrication, assembly and packaging at INO of various MEMS devices using heterogeneous
assembly at chip and package-level. First, the performance of a giant (e.g. about 3 mm in diameter), electrostatically
actuated beam steering mirror is presented. It can be rotated about two perpendicular axes to steer an optical beam within
an angular cone of up to 60° in vector scan mode with an angular resolution of 1 mrad and a response time of 300 ms. To
achieve such angular performance relative to mirror size, the microassembly was performed from sub-components
fabricated from 4 different wafers. To combine infrared detection with inertial sensing, an electroplated proof mass was
flip-chipped onto a 256×1 pixel uncooled bolometric FPA and released using laser ablation. In addition to the microassembly
technology, performance results of packaged devices are presented. Finally, to simulate a 3072×3 pixel
uncooled detector for cloud and fire imaging in mid and long-wave IR, the staggered assembly of six 512×3 pixel FPAs
with a less than 50 micron pixel co-registration is reported.
