Mika Aikio
at VTT Technical Research Ctr of Finland Ltd
SPIE Involvement:
Publications (9)

Proceedings Article | 20 September 2020 Presentation + Paper
Juho Luomahaara, Aki Mäyrä, Mika Aikio, Hannu Sipola, Leif Grönberg, Andrey Timofeev, Kirsi Tappura, Anssi Rautiainen, Juha Ala-Laurinaho, Aleksi Tamminen, Visa Vesterinen, Mikko Leivo, Feng Gao, Hannu Vasama, Arttu Luukanen, Juha Hassel
Proceedings Volume 11541, 1154105 (2020) https://doi.org/10.1117/12.2573891
KEYWORDS: Terahertz radiation, Imaging systems, Video, Cameras, Sensors, Detector arrays, Inductance, Image sensors, Signal to noise ratio, Bolometers

Proceedings Article | 23 April 2020 Presentation
Juho Luomahaara, Hannu Sipola, Leif Grönberg, Andrey Timofeev, Kirsi Tappura, Mika Aikio, Aki Mäyrä, Anssi Rautiainen, Visa Vesterinen, Mikko Leivo, Feng Gao, Hannu Vasama, Aleksi Tamminen, Arttu Luukanen, Juha Hassel
Proceedings Volume 11411, 114110J (2020) https://doi.org/10.1117/12.2558047
KEYWORDS: Terahertz radiation, Video, Cameras, Imaging systems, Sensors, Detector arrays, Inductance, Multiplexing, Image sensors, Signal to noise ratio

Proceedings Article | 21 October 2015 Paper
Juha Hassel, Andrey Timofeev, Visa Vesterinen, Hannu Sipola, Panu Helistö, Mika Aikio, Aki Mäyrä, Leif Grönberg, Arttu Luukanen
Proceedings Volume 9651, 96510G (2015) https://doi.org/10.1117/12.2197522
KEYWORDS: Sensors, Inductance, Superconductors, Imaging systems, Cryogenics, Terahertz radiation, Semiconducting wafers, Multiplexing, Staring arrays, Temperature metrology

SPIE Journal Paper | 2 December 2013
Ulrich Hofmann, Mika Aikio, Joachim Janes, Frank Senger, Vanessa Stenchly, Juergen Hagge, Hans-Joachim Quenzer, Manfred Weiss, Thomas von Wantoch, Christian Mallas, Bernhard Wagner, Wolfgang Benecke
JM3, Vol. 13, Issue 01, 011103, (December 2013) https://doi.org/10.1117/12.10.1117/1.JMM.13.1.011103
KEYWORDS: Mirrors, Microelectromechanical systems, Laser scanners, Roads, Sensors, Laser development, Packaging, Wafer bonding, Actuators

Proceedings Article | 13 March 2013 Paper
U. Hofmann, M. Aikio, J. Janes, F. Senger, V. Stenchly, M. Weiss, H.-J. Quenzer, B. Wagner, W. Benecke
Proceedings Volume 8616, 86160C (2013) https://doi.org/10.1117/12.2006189
KEYWORDS: Mirrors, Microelectromechanical systems, Semiconducting wafers, Sensors, Glasses, Silicon, Packaging, Wafer bonding, Wafer-level optics, Neodymium

Showing 5 of 9 publications
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