Dr. Shairfe Muhammad Salahuddin
at Intel Corp
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 28 April 2023 Poster + Paper
G. Mirabelli, A. Vandooren, C. Roda Neve, V. Gonzalez, H. Mertens, A. Farokhnejad, P. Schuddinck, G. Murdoch, S. Salahuddin, O. Zografos, L. Ragnarsson, P. Weckx, Z. Tokei, G. Hellings, J. Ryckaert
Proceedings Volume 12495, 124951K (2023) https://doi.org/10.1117/12.2656456
KEYWORDS: Semiconducting wafers, Metals, Back end of line, Silver, Optical lithography, Transmission electron microscopy, Nanosheets, Front end of line, Wafer bonding, Semiconductors

Proceedings Article | 28 April 2023 Presentation + Paper
Hsiao-Hsuan Liu, Shairfe Salahuddin, Boon Teik Chan, Pieter Schuddinck, Yang Xiang, Pieter Weckx, Geert Hellings, Francky Catthoor
Proceedings Volume 12495, 124950Z (2023) https://doi.org/10.1117/12.2657524
KEYWORDS: Fin field effect transistors, Silicon, Back end of line, Design rules, Metals, Transistors, Resistance, Fabrication, Epitaxy, Nanosheets

Proceedings Article | 28 April 2023 Presentation + Paper
G. Mirabelli, P. Schuddinck, H.-H. Liu, S. Yang, O. Zografos, S. Salahuddin, P. Weckx, G. Hiblot, G. Hellings, J. Ryckaert
Proceedings Volume 12495, 124950M (2023) https://doi.org/10.1117/12.2657726
KEYWORDS: Semiconducting wafers, Back end of line, Nanosheets, Logic, Standards development, Metals, Fin field effect transistors, Semiconductors, Optical lithography, Nanotechnology

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