PROCEEDINGS VOLUME 3880
SYMPOSIUM ON MICROMACHINING AND MICROFABRICATION | 20-22 SEPTEMBER 1999
MEMS Reliability for Critical and Space Applications
SYMPOSIUM ON MICROMACHINING AND MICROFABRICATION
20-22 September 1999
Santa Clara, CA, United States
Reliable Materials for MEMS I
Proc. SPIE 3880, Statistical characterization of fracture of brittle MEMS materials, 0000 (18 August 1999); doi: 10.1117/12.359368
Proc. SPIE 3880, Failure analysis of worn surface-micromachined microengines, 0000 (18 August 1999); doi: 10.1117/12.359369
Reliable Materials for MEMS II
Proc. SPIE 3880, Characterization of nonplanar motion in MEMS involving scanning laser interferometry, 0000 (18 August 1999); doi: 10.1117/12.359370
Proc. SPIE 3880, Critical point drying and cleaning for MEMS technology, 0000 (18 August 1999); doi: 10.1117/12.359371
Proc. SPIE 3880, Evaluation of micromechanical reliability of microactuator materials for hard-disk drive using the electrostatic test structure, 0000 (18 August 1999); doi: 10.1117/12.359372
Reliable MEMS for Critical Applications I
Proc. SPIE 3880, Developing a low-cost accelerometer for implantable pacemakers, 0000 (18 August 1999); doi: 10.1117/12.359373
Proc. SPIE 3880, Processes and materials for creating and maintaining reliable vacuum and other controlled atmospheres in hermetically sealed MEMS packages, 0000 (18 August 1999); doi: 10.1117/12.359356
Proc. SPIE 3880, Reliability issues of COTS MEMS for aerospace applications, 0000 (18 August 1999); doi: 10.1117/12.359357
Reliable MEMS for Critical Applications II
Proc. SPIE 3880, Resonance measurements of stresses in Al/Si3N4 microribbons, 0000 (18 August 1999); doi: 10.1117/12.359358
Proc. SPIE 3880, Analysis of an optical energy interrupter for MEMS-based safety and arming systems, 0000 (18 August 1999); doi: 10.1117/12.359359
Proc. SPIE 3880, Delamination study of chip-to-chip bonding for a LIGA-based safety and arming system, 0000 (18 August 1999); doi: 10.1117/12.359360
Proc. SPIE 3880, MEMS reliability for space applications by elimination of potential failure modes through testing and analysis, 0000 (18 August 1999); doi: 10.1117/12.359361
MEMS Qualification
Proc. SPIE 3880, Characterization and reliability of CMOS microstructures, 0000 (18 August 1999); doi: 10.1117/12.359362
Proc. SPIE 3880, MEMS reliability, process monitoring, and quality assurance, 0000 (18 August 1999); doi: 10.1117/12.359363
Proc. SPIE 3880, Reliability of microsystems based on a failure mechanism approach, 0000 (18 August 1999); doi: 10.1117/12.359364
Proc. SPIE 3880, Development of characterization tools for reliability testing of micro-electro-mechanical system actuators, 0000 (18 August 1999); doi: 10.1117/12.359365
Reliable Materials for MEMS I
Proc. SPIE 3880, Strength of polysilicon for MEMS devices, 0000 (18 August 1999); doi: 10.1117/12.359366
MEMS Qualification
Proc. SPIE 3880, Analysis of manufacturing-scale MEMS reliability testing, 0000 (18 August 1999); doi: 10.1117/12.359367
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