PROCEEDINGS VOLUME 6355
ASIA-PACIFIC OPTICAL COMMUNICATIONS | 3-7 SEPTEMBER 2006
Advanced LEDs for Solid State Lighting
IN THIS VOLUME

0 Sessions, 17 Papers, 0 Presentations
Proceedings Volume 6355 is from: Logo
ASIA-PACIFIC OPTICAL COMMUNICATIONS
3-7 September 2006
Gwangju, South Korea
Packaging and Thermal Analysis
Proc. SPIE 6355, Thermal design of high-power LED package and system, 635509 (21 September 2006); doi: 10.1117/12.690928
Proc. SPIE 6355, Optimal design of Fresnel lens for a reading light system with multiple light sources using three-layered hierarchical genetic algorithm, 63550A (21 September 2006); doi: 10.1117/12.687407
Proc. SPIE 6355, A numerical analysis of a high-index nanocomposite encapsulant and a roughened surface, 63550B (21 September 2006); doi: 10.1117/12.687783
Proc. SPIE 6355, Thermal simulation studies of high-power light-emitting diodes, 63550D (21 September 2006); doi: 10.1117/12.691605
Proc. SPIE 6355, Thermal analysis of multichip LED packages, 63550E (21 September 2006); doi: 10.1117/12.691560
LED Measurement
Proc. SPIE 6355, A new approach to preparation of standard LEDs for luminous intensity and flux measurement of LEDs, 63550G (21 September 2006); doi: 10.1117/12.692741
Proc. SPIE 6355, Measuring light emission from LEDs, 63550H (28 September 2006); doi: 10.1117/12.692731
LED Chip and Process II
Proc. SPIE 6355, Ohmic characteristics of Pt and Ni/Au on Mg-doped AlxGa1-xN, 63550J (28 September 2006); doi: 10.1117/12.689268
Proc. SPIE 6355, The effect of processes on the reliability of GaN-based light emitting diodes, 63550K (28 September 2006); doi: 10.1117/12.691155
Epitaxy and Characterization III
Proc. SPIE 6355, Epitaxy of GaN LEDs on large substrates: Si or sapphire?, 63550R (21 September 2006); doi: 10.1117/12.691576
LED Chip and Process III
Proc. SPIE 6355, A new I-V model for light emitting devices with a quantum well, 63550V (21 September 2006); doi: 10.1117/12.691773
Poster Session
Proc. SPIE 6355, Holographic technique of generating large-size mask with hexagonal pattern for photonic crystal LED fabrication, 63550X (21 September 2006); doi: 10.1117/12.687899
Proc. SPIE 6355, Novel fluorescent polymer-zinc oxide hybrids for brightand efficient white light emitting diodes, 63550Z (21 September 2006); doi: 10.1117/12.688520
Proc. SPIE 6355, Growth of low-defect AlGaN by lateral epitaxy over V-grooved sapphire substrates fabricated by wet chemical etching, 635511 (21 September 2006); doi: 10.1117/12.689067
Proc. SPIE 6355, Characterization of chip size effect on thermal-optical properties of GaN-based light emitting diodes, 635515 (28 September 2006); doi: 10.1117/12.691282
Proc. SPIE 6355, Thermal effects of moisture inducing delamination in light-emitting diode packages, 635516 (28 September 2006); doi: 10.1117/12.691555
Proc. SPIE 6355, Effect of LiF-electron injection layer thickness on efficiencies of organic light emitting diode, 635519 (28 September 2006); doi: 10.1117/12.688636
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