Paper
7 July 1997 Effect of the partial coherence on reflective notching
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Abstract
This paper explores through numerical simulation and experiment the role of partial coherent illumination on reflective notching in optical projection printing over a nonplanar substrate. The intensity in the photoresist when patterning a gate line over a LOCOS generated active area well covered in polysilicon was simulated with the rigorous electromagnetic simulation program TEMPEST-PCD which includes partial coherence through a decomposition method. The simulation results are compared to experimental SEM pictures of developed photoresist lines for patterning a gate over a trench with varying moat widths when using a DUV 248 nm stepper with a NA of 0.5 for a (sigma) of 0.3 and 0.6. Variations in linewidth of both plus and minus 20% are observed due to the interactions with the underlying topography. The simulations give physical insight into trends seen in the experimental critical dimension (CD) measurements. Simulations indicate that most of the effects observed are due to lateral specular reflection from the underlying structure aiding in the dissolution of the resist near the feature. These trends seen in simulation and in experiment indicate that the topography has a similar impact on the CD regardless of the coherence.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert John Socha, Christopher J. Progler, and Andrew R. Neureuther "Effect of the partial coherence on reflective notching", Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); https://doi.org/10.1117/12.275979
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Cited by 1 scholarly publication.
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KEYWORDS
Reflectivity

Critical dimension metrology

Optical lithography

Photoresist materials

Deep ultraviolet

Electromagnetic simulation

Numerical simulations

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