High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems

Jennifer Fullam; Carol Boye; Theodorus Standaert; John Gaudiello; Derek Tomlinson; Hong Xiao; Wei Fang; Xu Zhang; Fei Wang; Long Ma; Yan Zhao; Jack Jau

doi:10.1117/12.879910

28 April 2011 High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems

Jennifer Fullam, Carol Boye, Theodorus Standaert, John Gaudiello, Derek Tomlinson, Hong Xiao, Wei Fang, Xu Zhang, Fei Wang, Long Ma, Yan Zhao, Jack Jau

Author Affiliations +

Proceedings Volume 7971, Metrology, Inspection, and Process Control for Microlithography XXV; 79710Y (2011) https://doi.org/10.1117/12.879910
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

In this paper, we tested a novel methodology of measuring critical dimension (CD) uniformity, or CDU, with electron beam (e-beam) hotspot inspection and measurement systems developed by Hermes Microvision, Inc. (HMI). The systems were used to take images of two-dimensional (2D) array patterns and measure CDU values in a custom designated fashion. Because this methodology combined imaging of scanning micro scope (SEM) and CD value averaging over a large array pattern of optical CD, or OCD, it can measure CDU of 2D arrays with high accuracy, high repeatability and high throughput.

Citation Download Citation

Jennifer Fullam, Carol Boye, Theodorus Standaert, John Gaudiello, Derek Tomlinson, Hong Xiao, Wei Fang, Xu Zhang, Fei Wang, Long Ma, Yan Zhao, and Jack Jau "High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79710Y (28 April 2011); https://doi.org/10.1117/12.879910

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