Poster
22 November 2023 Track solutions for enhanced resist stability: a leap towards high-NA EUVL manufacturability
Author Affiliations +
Conference Poster
Abstract
While several leading semiconductor manufacturers are already heavily investing in the development of high-NA EUV technology, there are still some technical challenges to overcome. Photoresists are identified as main drivers to achieve the required ultimate resolution, with the development of new EUV materials being ranked as one of the top priorities to address. Currently, MOR is the primary candidate for patterning at 0.55NA relevant pitches, but stability still must be demonstrated. The aim of this work was to extend the current knowledge about the impact of delay effects on resist stability. The effect of post-coating, post-exposure and post-PEB delay on litho performance were thoroughly analyzed and compared for metal oxide and main-chain scission resist platforms. It has been observed that for both chemistries, track stand-alone processing might be a possible and effective approach to explore towards high-NA, bringing more flexibility and enabling higher throughput.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Andreia Santos, Elke Caron, Wesley Zanders, Seonggil Heo, Jelle Vandereyken, and Masahiko Harumoto "Track solutions for enhanced resist stability: a leap towards high-NA EUVL manufacturability", Proc. SPIE PC12750, International Conference on Extreme Ultraviolet Lithography 2023, PC127500U (22 November 2023); https://doi.org/10.1117/12.2687522
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KEYWORDS
Extreme ultraviolet lithography

Manufacturing

Metal oxides

Photoresist developing

Optical lithography

Photoresist materials

Printing

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