Dr. Jian Mi
Senior Director of Applications at Four Dimensions Inc
SPIE Involvement:
Publications (4)

Proceedings Article | 20 March 2020 Presentation + Paper
Proceedings Volume 11325, 113250L (2020) https://doi.org/10.1117/12.2551610
KEYWORDS: Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Overlay metrology, Sensors, Signal detection, 3D metrology, Etching, Electron beams, Electron microscopes

Proceedings Article | 20 March 2020 Presentation + Paper
Proceedings Volume 11325, 113250O (2020) https://doi.org/10.1117/12.2551622
KEYWORDS: Semiconducting wafers, Machine learning, Wafer-level optics, 3D metrology, Metrology, Channel projecting optics, Optical metrology, Principal component analysis, Scanning electron microscopy, Etching

Proceedings Article | 20 March 2019 Paper
Proceedings Volume 10962, 1096217 (2019) https://doi.org/10.1117/12.2524569
KEYWORDS: Metrology, Semiconducting wafers, Image processing, Metals, 3D metrology, Atomic force microscopy, Chemical mechanical planarization, 3D image processing, Wafer bonding, Data processing

Proceedings Article | 13 March 2018 Paper
Jian Mi, Ziqi Chen, Li Ming Tu, Xiaoming Mao, Gong Cai Liu, Hiroki Kawada
Proceedings Volume 10585, 105852S (2018) https://doi.org/10.1117/12.2297249
KEYWORDS: Double patterning technology, Metrology, Optical inspection, Scanning electron microscopy, Image compression, Visualization, Inspection, Semiconducting wafers, Image visualization, Image enhancement

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