Dr. Warren W. Flack
Vice President, Applications at Ultratech Inc
SPIE Involvement:
Author
Publications (46)

PROCEEDINGS ARTICLE | March 26, 2007
Proc. SPIE. 6520, Optical Microlithography XX
KEYWORDS: Microelectromechanical systems, Packaging, Wafer-level optics, Lithography, Metrology, Silicon, Image sensors, Optical alignment, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 29, 2006
Proc. SPIE. 6153, Advances in Resist Technology and Processing XXIII
KEYWORDS: Nanotechnology, Lithography, Photography, Scanning electron microscopy, Photoresist materials, Head, Photosensitive materials, Photoresist processing, Semiconducting wafers, Photoresist developing

PROCEEDINGS ARTICLE | March 29, 2006
Proc. SPIE. 6153, Advances in Resist Technology and Processing XXIII
KEYWORDS: Packaging, Lithography, Sputter deposition, Copper, Silicon, Photography, Scanning electron microscopy, Photoresist materials, Photosensitive materials, Semiconducting wafers

PROCEEDINGS ARTICLE | May 10, 2005
Proc. SPIE. 5752, Metrology, Inspection, and Process Control for Microlithography XIX
KEYWORDS: Microelectromechanical systems, Lithography, Metrology, Cameras, Calibration, Manufacturing, Image registration, Precision measurement, Optical alignment, Semiconducting wafers

PROCEEDINGS ARTICLE | May 4, 2005
Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII
KEYWORDS: Packaging, Lithography, Coating, Scanning electron microscopy, Photoresist materials, Plating, Thin film coatings, Semiconducting wafers, Electroplating, Photoresist developing

PROCEEDINGS ARTICLE | May 4, 2005
Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII
KEYWORDS: Packaging, Lithography, Reticles, Chemistry, Scanning electron microscopy, Photoresist materials, Semiconducting wafers, Electroplating, Photoresist developing, Standards development

Showing 5 of 46 publications
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