Yoshiharu Sakurai
at Merck Electronics Ltd
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 1 May 2023 Poster + Paper
Proceedings Volume 12498, 124981K (2023) https://doi.org/10.1117/12.2657694
KEYWORDS: Photoresist materials, Copper, Semiconducting wafers, Film thickness, Advanced packaging, Metals, Plating, Baking, Silicon, Photoresist processing

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