Dr. David M. Fried
Corporate Vice President at Lam Research
SPIE Involvement:
Conference Program Committee | Author
Publications (8)

SPIE Journal Paper | 12 July 2023 Open Access
Michael Hargrove, Sandy Wen, Daebin Yim, Kira Egelhofer Ruegger, Pradeep Nanja, Sumant Sarkar, Brett Lowe, Benjamin Vincent, Joseph Ervin, David Fried
JM3, Vol. 22, Issue 03, 031209, (July 2023) https://doi.org/10.1117/12.10.1117/1.JMM.22.3.031209
KEYWORDS: Etching, Metrology, Process modeling, Semiconducting wafers, 3D modeling, 3D metrology, Logic, Critical dimension metrology, Diffractive optical elements, Fabrication

Proceedings Article | 22 February 2021 Presentation + Paper
Ye Feng, Joseph Ervin, Yang Lu, Anthony Woo, Martyn Coogans, Ivan Chakarov, David Fried
Proceedings Volume 11614, 116140I (2021) https://doi.org/10.1117/12.2582789
KEYWORDS: Process modeling, Calibration, Gallium arsenide, Instrument modeling, 3D modeling, Fin field effect transistors, Transmission electron microscopy, Silicon, Scatterometry, Manufacturing

Proceedings Article | 20 March 2019 Presentation + Paper
Proceedings Volume 10963, 109630H (2019) https://doi.org/10.1117/12.2518553
KEYWORDS: Etching, Bridges, Photoresist processing, Extreme ultraviolet lithography, Metrology, Computer simulations, Focus stacking software, Stochastic processes, Time metrology, Optical lithography

Proceedings Article | 24 March 2017 Presentation + Paper
Mustafa Akbulut, Jiangjiang Gu, Andras Pap, Vasanth Allampalli, Daniel Faken, Joseph Ervin, Ken Greiner, David Fried
Proceedings Volume 10147, 101470G (2017) https://doi.org/10.1117/12.2258157
KEYWORDS: Photoresist materials, Line edge roughness, Critical dimension metrology, Metals, Optical lithography, Double patterning technology, Capacitance, Photoresist processing, Front end of line, Back end of line, Etching, Transistors

SPIE Journal Paper | 13 September 2016
Mattan Kamon, Mustafa Akbulut, Yiguang Yan, Daniel Faken, Andras Pap, Vasanth Allampalli, Ken Greiner, David Fried
JM3, Vol. 15, Issue 03, 031605, (September 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.3.031605
KEYWORDS: Directed self assembly, Etching, Optical lithography, Process modeling, Capacitors, Device simulation, 3D modeling, Polymers, Virtual reality, Reactive ion etching

Showing 5 of 8 publications
Conference Committee Involvement (3)
DTCO and Computational Patterning IV
23 February 2025 | San Jose, California, United States
DTCO and Computational Patterning III
26 February 2024 | San Jose, California, United States
DTCO and Computational Patterning II
27 February 2023 | San Jose, California, United States
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