Dr. Paul O. Leisher
at Lawrence Livermore National Lab
SPIE Involvement:
Education Committee | Senior status | Conference Chair | Track Chair | Author | Editor | Instructor
Publications (46)

PROCEEDINGS ARTICLE | May 4, 2018
Proc. SPIE. 10637, Laser Technology for Defense and Security XIV
KEYWORDS: Thermography, High power lasers, Gallium arsenide, Resistance, Reflectivity, Semiconductor lasers, CCD cameras, Bismuth, Temperature metrology, Absorption

SPIE Conference Volume | April 3, 2018

PROCEEDINGS ARTICLE | February 20, 2018
Proc. SPIE. 10513, Components and Packaging for Laser Systems IV
KEYWORDS: Semiconductors, High power lasers, Laser applications, Laser development, Resistance, Corrosion, Fiber lasers, Semiconductor lasers, Diodes, Laser systems engineering

PROCEEDINGS ARTICLE | February 19, 2018
Proc. SPIE. 10514, High-Power Diode Laser Technology XVI
KEYWORDS: Semiconductors, Optical amplifiers, Oscillators, Waveguides, Sensors, Satellites, High power lasers, Laser development, Semiconductor lasers, Free space optical communications

PROCEEDINGS ARTICLE | August 30, 2017
Proc. SPIE. 10406, Lidar Remote Sensing for Environmental Monitoring 2017
KEYWORDS: Mid-IR, Tunable lasers, Methane, Carbon dioxide, LIDAR, Laser applications, Semiconductor lasers, Pollution

PROCEEDINGS ARTICLE | April 20, 2017
Proc. SPIE. 10123, Novel In-Plane Semiconductor Lasers XVI
KEYWORDS: Optical microscopes, Continuous wave operation, Optical amplifiers, Semiconductor lasers, Photonics, Thermal effects, Current controlled current source

Showing 5 of 46 publications
Conference Committee Involvement (5)
Components and Packaging for Laser Systems V
2 February 2019 | San Francisco, California, United States
Components and Packaging for Laser Systems IV
30 January 2018 | San Francisco, California, United States
Components and Packaging for Laser Systems III
31 January 2017 | San Francisco, California, United States
Components and Packaging for Laser Systems II
16 February 2016 | San Francisco, California, United States
Components and Packaging for Laser Systems
9 February 2015 | San Francisco, California, United States
Course Instructor
SC1091: Fundamentals of Reliability Engineering for Optoelectronic Devices
Component reliability impacts the bottom line of every supplier and customer in the optics industry. Nevertheless, a solid understanding of the fundamental principles of reliability is often limited to a small team of engineers who are responsible for product reliability for an entire organization. There is tremendous value in expanding this knowledge base to others to ensure that all stakeholders (product engineers, managers, technicians, and even customers) speak a "common language" with respect to the topic of reliability. This course provides a broad foundation in reliability engineering methods applied to lifetest design and data analysis. While the course focuses on the application of reliability engineering to optoelectronic devices, the underlying principles can be applied to any component.
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