Presentation + Paper
26 May 2022 Subsurface scanning probe metrology for overlay through opaque layers
I. Battisti, K. M. Makles, M. S. J. Mucientes, Y. Guo, E. Simons, J. Bogdanowicz, A. Moussa, V. Blanco, F. Yasin, D. Crotti, A.-L. Charley, P. Leray, M. E. van Reijzen, C. Bozdog, H. Sadeghian
Author Affiliations +
Abstract
The performance of image-based and diffraction-based overlay metrology depends on the quality of optical signal returning from the buried mark. A desirable class of hard mask materials are the metal-based hard masks. The challenge with metal-based hard masks is that they are typically opaque in the visible range. To enable overlay metrology, a costly process integration scheme replaces the opaque material over the overlay target, while another detects residual topography propagating through the film. Here we discuss the progress towards the fully automated Scanning Probe Metrology tool that combines surface and subsurface channel information in a single image to measure overlay through opaque films.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
I. Battisti, K. M. Makles, M. S. J. Mucientes, Y. Guo, E. Simons, J. Bogdanowicz, A. Moussa, V. Blanco, F. Yasin, D. Crotti, A.-L. Charley, P. Leray, M. E. van Reijzen, C. Bozdog, and H. Sadeghian "Subsurface scanning probe metrology for overlay through opaque layers", Proc. SPIE 12053, Metrology, Inspection, and Process Control XXXVI, 1205310 (26 May 2022); https://doi.org/10.1117/12.2616093
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KEYWORDS
Overlay metrology

Semiconducting wafers

Opacity

Atomic force microscopy

Image resolution

Scanning probe metrology

Photomasks

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