CONFERENCE PROCEEDINGS
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Hsiao Fei Su
at KLA Corp.
SPIE Involvement:
Author
Publications (3)
Proceedings Article | 10 April 2024 Poster + Paper
Global tilt measurement on irregular PIL supporting patterns in 3D NAND memory
Yung-Yi Lin, Tien-Jung Lee, Hsiao-Fei Su, Yen-Hung Liu, Chao-Yu Cheng, Christopher Liman, Boxue Chen, Zhengquan Tan, Ming-Tsung Wu, Min-Hsuan Huang, Yao-Yuan Chang, Hong-Ji Lee, Nan-Tzu Lian
Proceedings Volume 12955, 129552Z (2024) https://doi.org/10.1117/12.3010532
KEYWORDS: Etching, Semiconducting wafers, Metrology, Diffraction, 3D metrology, X-rays, 3D modeling, Silicon nitride, Scanning electron microscopy, X-ray diffraction
Proceedings Article | 10 April 2024 Poster + Paper
Global tilt extraction for BEOL contact landing displacement control
Yung-Yi Lin, Tien-Jung Lee, Hsiao-Fei Su, Yen-Hung Liu, Chao-Yu Cheng, Christopher Liman, Boxue Chen, Zhengquan Tan, Yuan-Chieh Chiu, Chiung-Kun Huang, Ying-Hung Liang, Hong-Ji Lee, Nan-Tzu Lian
Proceedings Volume 12955, 1295532 (2024) https://doi.org/10.1117/12.3010726
KEYWORDS: X-rays, Semiconducting wafers, Etching, Metrology, 3D metrology, Back end of line, Scattering, 3D modeling, Transmission electron microscopy, Optical alignment
Proceedings Article | 26 May 2022 Poster + Presentation + Paper
In device overlay control with multiple overlay metrology in 3D-NAND process
Proceedings Volume 12053, 120531P (2022) https://doi.org/10.1117/12.2613193
KEYWORDS: Overlay metrology, Single crystal X-ray diffraction, Metrology, Semiconducting wafers, 3D metrology, Control systems, Process modeling, Polishing, Etching, Image processing
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