Proceedings Volume 8608 is from: Logo
SPIE LASE
2-7 February 2013
San Francisco, California, United States
Front Matter: Volume 8608
Proc. SPIE 8608, Front Matter: Volume 8608, 860801 (28 March 2013); doi: 10.1117/12.2025067
Laser Micro-and Nanostructuring I
Proc. SPIE 8608, Periodically structured Silicon substrate by microsphere-assisted laser interactions , 860803 (22 February 2013); doi: 10.1117/12.2004169
Proc. SPIE 8608, Picosecond and nanosecond pulsed laser ablation of aluminium, polypropylene, polyethylene, and their thin-film combinations, 860804 (15 March 2013); doi: 10.1117/12.2003953
Proc. SPIE 8608, Improvement of laser dicing system performance I: high-speed, high-quality processing of thick silicon wafers using spatial light modulator, 860805 (15 March 2013); doi: 10.1117/12.2003639
Proc. SPIE 8608, Laser-induced self-organizing surface structures on cathode materials for lithium-ion batteries, 860806 (15 March 2013); doi: 10.1117/12.2006372
Proc. SPIE 8608, Thin film passivation of laser generated 3D micro patterns in lithium manganese oxide cathodes, 860807 (15 March 2013); doi: 10.1117/12.2006373
Laser Micro- and Nanostructuring II
Proc. SPIE 8608, High speed micro scanner for 3D in-volume laser micro processing , 860808 (15 March 2013); doi: 10.1117/12.2008205
Proc. SPIE 8608, Improvement of laser dicing performance II: dicing rate enhancement by multi beams and simultaneous aberration correction with phase-only spatial light modulator, 860809 (15 March 2013); doi: 10.1117/12.2003649
Proc. SPIE 8608, High speed micromachining with high power UV laser, 86080A (15 March 2013); doi: 10.1117/12.2008698
Proc. SPIE 8608, UV laser writing system based on polar scanning strategy to produce subwavelength metal gratings for surface plasmon resonance, 86080B (15 March 2013); doi: 10.1117/12.1000137
Ultrashort Pulsed Laser Processing
Proc. SPIE 8608, Ultrafast laser trimming for reduced device leakage in high performance OTFT semiconductors for flexible displays, 86080D (15 March 2013); doi: 10.1117/12.2004007
Proc. SPIE 8608, Picosecond laser ablation of transparent materials, 86080E (15 March 2013); doi: 10.1117/12.2001991
Proc. SPIE 8608, Metal microdrilling combining high power femtosecond laser and trepanning head, 86080F (15 March 2013); doi: 10.1117/12.2002083
Direct-write Processing and Surface Modification
Proc. SPIE 8608, Laser direct writing of graphene patterns on SiO2/Si substrates, 86080J (15 March 2013); doi: 10.1117/12.2001405
Proc. SPIE 8608, Laser transfer of reconfigurable patterns with a spatial light modulator , 86080K (15 March 2013); doi: 10.1117/12.2005345
Packaging and Additive Manufacturing
Proc. SPIE 8608, Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices, 86080L (15 March 2013); doi: 10.1117/12.2004344
Proc. SPIE 8608, Cellular scanning strategy for selective laser melting: evolution of optimal grid-based scanning path and parametric approach to thermal homogeneity, 86080M (15 March 2013); doi: 10.1117/12.2004256
Proc. SPIE 8608, Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating , 86080O (15 March 2013); doi: 10.1117/12.2001848
Proc. SPIE 8608, Pulsed Nd:YAG laser fine spot welding for attachment of refractory mini-pins, 86080P (15 March 2013); doi: 10.1117/12.2005842
Photovoltaics, Alternative Energy Sources and Advanced Energy Storage Systems: Joint Session with 8607 and 8608
Proc. SPIE 8608, Diode laser processed crystalline silicon thin-film solar cells, 86080Q (15 March 2013); doi: 10.1117/12.2002247
Proc. SPIE 8608, The photovoltaic potential of femtosecond-laser textured amorphous silicon , 86080R (15 March 2013); doi: 10.1117/12.2005451
Proc. SPIE 8608, Laser scribing integration of polycrystalline thin film solar cells , 86080S (15 March 2013); doi: 10.1117/12.2003987
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