Unsupervised ML classification driven process model coverage check

SeungWon Song; Seokyoon Jeong; Sangwoo Park; Jungkee Choi; WoonHyuk Choi; No-young Chung; Seongtae Jeong; Fan Jiang; Liang Cao; Le Hong; Junhyoung Park; Doohwan Kwak; Jongwon Lee; Harin Kim; Jiyoung Lee

doi:10.1117/12.2658322

28 April 2023 Unsupervised ML classification driven process model coverage check

SeungWon Song, Seokyoon Jeong, Sangwoo Park, Jungkee Choi, WoonHyuk Choi, No-young Chung, Seongtae Jeong, Fan Jiang, Liang Cao, Le Hong, Junhyoung Park, Doohwan Kwak, Jongwon Lee, Harin Kim, Jiyoung Lee

Author Affiliations +

Proceedings Volume 12495, DTCO and Computational Patterning II; 1249518 (2023) https://doi.org/10.1117/12.2658322
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

Semiconductor manufacturing’s full chip RET/OPC operations rely on the process models calibrated against metrology data collected from custom designed test structures. Physics-based compact models and machine learning models inherently carry the issue of model coverage often synonymous with calibration test pattern coverage. Therefore, process models frequently fail to predict unseen patterns within error tolerance. With the push for advanced technology node, such events can even occur after a node is declared HVM ready. Foundries have been combating the model coverage deficiency through costly model revisions, or expensive repair flows. There has always been the desire to have capability to screen and enhance compact model of potential coverage issue. In this paper, we use the machine learning clustering platform to learn the signatures of the model calibration test patterns and then compare them to the new design patterns in terms of feature vectors’ space correlated to model parameters’ space. The comparison provides not only the locations of the new patterns but also the similarity ranking with respect to the reference pattern, so that those patterns can be included and be further analyzed for better model coverage. These patterns are often suitable candidates to be included into new model calibration set. In this application, full chip capability is also essential besides the accuracy of the learning. The full-chip pattern check needs to be done quickly and efficiently; hence this technology could be adopted for new chip screening, highlighting areas worth paying extra attention to during inspection.

Conference Presentation

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SeungWon Song, Seokyoon Jeong, Sangwoo Park, Jungkee Choi, WoonHyuk Choi, No-young Chung, Seongtae Jeong, Fan Jiang, Liang Cao, Le Hong, Junhyoung Park, Doohwan Kwak, Jongwon Lee, Harin Kim, and Jiyoung Lee "Unsupervised ML classification driven process model coverage check", Proc. SPIE 12495, DTCO and Computational Patterning II, 1249518 (28 April 2023); https://doi.org/10.1117/12.2658322

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