Progress toward developing high performance immersion compatible materials and processes

Karen Petrillo; Kaushal Patel; Rex Chen; Wenjie Li; Ranee Kwong; Peggy Lawson; Rao Varanasi; Chris Robinson; Steven J. Holmes; Dario Gil; Kurt Kimmel; Mark Slezak; Gary Dabbagh; Takashi Chiba; Tsutomu Shimokawa

doi:10.1117/12.601621

4 May 2005 Progress toward developing high performance immersion compatible materials and processes

Karen Petrillo, Kaushal Patel, Rex Chen, Wenjie Li, Ranee Kwong, Peggy Lawson, Rao Varanasi, Chris Robinson, Steven J. Holmes, Dario Gil, Kurt Kimmel, Mark Slezak, Gary Dabbagh, Takashi Chiba, Tsutomu Shimokawa

Author Affiliations +

Proceedings Volume 5753, Advances in Resist Technology and Processing XXII; (2005) https://doi.org/10.1117/12.601621
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

To make immersion lithography a reality in manufacturing, several challenges related to materials and defects must be addressed. Two such challenges include the development of water immersion compatible materials, and the vigorous pursuit of defect reduction with respect to both the films and the processes. Suitable resists and topcoats must be developed to be compatible with the water-soaked environment during exposure. Going beyond the requisite studies of component leaching from films into the water, and absorption of water into the films, application-specific optimization of photoresists and top coats will be required. This would involve an understanding of how a wide array of resist chemistry and formulations behave under immersion conditions. The intent of this paper is to compare lithographic performance under immersion and dry conditions of resists containing different polymer platforms, protecting groups, and formulations. The compatibility of several developer-soluble top-coat materials with a variety of resists is also studied with emphasis on profile control issues. With respect to defects, the sources are numerous. Bubbles and particles created during the imaging process, material remnants from incomplete removal of topcoats, and image collapse as related to resist swelling from water infusion are all sources of yield-limiting defects. Parallel efforts are required in the material development cycle focusing both on meeting the lithographic requirements, and on understanding and eliminating sources of defects. In this paper, efforts in the characterization and reduction of defects as related to materials chemistry and processing effects will be presented.

Citation Download Citation

Karen Petrillo, Kaushal Patel, Rex Chen, Wenjie Li, Ranee Kwong, Peggy Lawson, Rao Varanasi, Chris Robinson, Steven J. Holmes, Dario Gil, Kurt Kimmel, Mark Slezak, Gary Dabbagh, Takashi Chiba, and Tsutomu Shimokawa "Progress toward developing high performance immersion compatible materials and processes", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); https://doi.org/10.1117/12.601621

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available