CONFERENCE PROCEEDINGS
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Anshul Gupta
at imec
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Author
Publications (3)
Proceedings Article | 26 May 2022 Presentation + Paper
Challenges with SOT-MRAM integration towards N5 node and beyond
M. Gupta, M. Perumkunnil, F. Yasin, G. Mirabelli, K. Garello, A. Gupta, A. Furnémont, G. Kar
Proceedings Volume 12052, 1205202 (2022) https://doi.org/10.1117/12.2613482
KEYWORDS: Metals, Transistors, Resistance, Front end of line, Switching, Optical lithography, Magnetism, Copper, Back end of line, Logic
Proceedings Article | 25 May 2022 Presentation + Paper
Middle-of-line plasma dry etch challenges for buried power rail integration
Proceedings Volume 12056, 120560C (2022) https://doi.org/10.1117/12.2616731
KEYWORDS: Etching, Metals, Plasma etching, Optical lithography, Ruthenium, Plasma, Tin, Dielectrics, Dry etching, Molybdenum
Proceedings Article | 25 May 2022 Presentation + Paper
Buried power rail integration for CMOS scaling beyond the 3 nm node
A. Gupta, Z. Tao, D. Radisic, H. Mertens, O. Varela Pedreira, S. Demuynck, J. Bömmels, K. Devriendt, N. Heylen, S. Wang, K. Kenis, L. Teugels, F. Sebaai, C. Lorant, N. Jourdan, B. Chan, S. Subramanian, F. Schleicher, A. Peter, N. Rassoul, Y. Siew, B. Briggs, D. Zhou, E. Rosseel, E. Capogreco, G. Mannaert, A. Sepúlveda, E. Dupuy, K. Vandersmissen, B. Chehab, G. Murdoch, E. Altamirano Sanchez, S. Biesemans, Zs. Tőkei, E. Dentoni Litta, N. Horiguchi
Proceedings Volume 12056, 120560B (2022) https://doi.org/10.1117/12.2615641
KEYWORDS: Ruthenium, Metals, Molybdenum, Etching, Tungsten, Front end of line, Chemical mechanical planarization, Silicon
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