Yongchan Kim
at SAMSUNG Electronics Co., Ltd.
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 28 April 2023 Paper
Proceedings Volume 12494, 124940Y (2023) https://doi.org/10.1117/12.2657203
KEYWORDS: Semiconducting wafers, Critical dimension metrology, Sensors, Scanners, High volume manufacturing, Lithography, Optical lithography, Distributed interactive simulations, Device simulation, Process control

Proceedings Article | 27 April 2023 Presentation + Paper
Hyosung Lee, Seonho Lee, Hyungju Rah, Iksun Park, Jaeil Lee, Jaewoong Sohn, Yongchan Kim, Christoph Ehrlich, Philip Groeger, Sven Boese, Enrico Bellmann, Stefan Buhl, Seop Kim, Kang-san Lee
Proceedings Volume 12496, 124961P (2023) https://doi.org/10.1117/12.2657679
KEYWORDS: Critical dimension metrology, Semiconducting wafers, Scanning electron microscopy, Image processing, Image restoration, Education and training, Contour extraction, Machine learning, Deformation, Finite element methods

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