Mr. Frankie F. G. Tsai Profile

Frankie F. G. Tsai

Section Manager at Taiwan Semiconductor Manufacturing Co Ltd

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Author

Publications (10)

Proceedings Article | 26 August 2024 Paper

Actinic inspection improvement and application in high volume manufacturing for N3 node and beyond

Hao-Ming Chang, Hsin-Fu Tseng, C.H. Lu, S.C. Hsu, Yu-Ting Chen, Wei-Chung Hu, Ajay Nandoriya, Yi-An Huang, Yung-Sheng Chang, C.W. Wen, C.L. Chen, Frankie F. Tsai, Keisuke Noguchi, Hiroki Miyai, Masayasu Nishizawa, Atsushi Tajima, Hirokazu Seki

Proceedings Volume 13177, 131770Q (2024) https://doi.org/10.1117/12.3032058

KEYWORDS: Extreme ultraviolet, Inspection, Tin, Actinic inspection, Pellicles, Deep ultraviolet, High volume manufacturing, Deep learning, Manufacturing, Liquids

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Proceedings Article | 26 August 2024 Paper

Make a core engine ready to empower high quality multi-beam mask writer for N2 node and beyond

Patrick P. Lee, Peter J. Chang, Frankie F. Tsai, Harry C. Ku, Min-Da Cheng, Joey J. Wang, M. J. Lii, Jacqueline Atanelov, Anh-Dai Dang, Samuel Kvasnica

Proceedings Volume 13177, 131770T (2024) https://doi.org/10.1117/12.3032467

KEYWORDS: Microelectromechanical systems, Inspection, Fabrication, Photomasks

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Proceedings Article | 4 December 2023 Presentation + Paper

A core engine to enable high quality multi-beam mask writers for 2nm node and beyond

Patrick P. Lee, Frankie F. Tsai, Harry C. Ku, Min-Da Cheng, Joey J. Wang, Peter J. Chang, M. Lii, Jacqueline Atanelov, Anh-Dai Dang, Samuel Kvasnica

Proceedings Volume PC12751, PC127510S (2023) https://doi.org/10.1117/12.2688300

KEYWORDS: Telecommunications, Optical proximity correction, Microelectromechanical systems, Optics manufacturing, Optical communications, Electrodes, Data communications, CMOS technology, CMOS devices

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Proceedings Article | 21 November 2023 Presentation + Paper

EUV APSM mask prospects and challenges

Shy-Jay Lin, Chien-Min Lee, Yen-Liang Chen, Kuo-Lun Tai, Lee-Feng Chen, Chien-Chao Huang, Frankie F. Tsai

Proceedings Volume 12751, 127510N (2023) https://doi.org/10.1117/12.2688111

KEYWORDS: 3D mask effects, Extreme ultraviolet, Extreme ultraviolet lithography, Thermal stability, Stochastic processes, Semiconducting wafers, Refractive index, Projection systems, Photoresist materials, Photons

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Proceedings Article | 21 November 2023 Presentation + Paper

Actinic inspection technology enhancement for N3 node and beyond

Hao-Ming Chang, Hsin-Fu Tseng, C. Lu, S. Hsu, Wei-Chung Hu, Ajay Nandoriya, Yi-An Huang, Yung-Sheng Chang, C. Wen, Frankie F. Tsai, Hiroki Miyai, Masayasu Nishizawa, Atsushi Tajima, Hirokazu Seki

Proceedings Volume 12751, 1275103 (2023) https://doi.org/10.1117/12.2688174

KEYWORDS: Tin, Extreme ultraviolet, Inspection, Pellicles, Liquids, Plasma, Actinic inspection, Design and modelling, Deep ultraviolet, Sensors

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Given the successful development in actinic pattern mask inspection (APMI), high-volume manufacturing of advanced chips including N5 and N3 was realized due to the defect-free masks provided by the TSMC mask shop. This achievement was attributed to the newly developed EUV source and GPU-based defect detection with machine learning (ML) assistance. Unlike conventional approaches which sustain less than two weeks, the rotated crucible fed by Sn fuel in the LPP (Laser-produced plasma) system provided one month of operating stability with ultra-low tin consumption. The newly developed LPP EUV light source has been moved towards double IR power to produce higher EUV photon counts, resulting in better throughput and inspection sensitivity. It enables captured images to possess an effective signalto-noise ratio (SNR) and reasonable inspection nuisance counts. The common technique challenges, Sn auto-refuel and debris mitigation, were overcome by auto-refuel and reuse, debris mitigation, and plasma position control. Moreover, the LPP system also showed its capability in performing pellicle inspection to prolong mask operation periods in wafer foundries. For the GPU-based inspection system, it provided the feasibility and flexibility in algorithm development compared to the FPGA approach. The TSMC developed machine-learning (ML) based rendering model played a key role in aligning features with tool images in D2D mode, as well as residue reduction of D2DB mode. All rendering models were implemented by CUDA coding and running on TSMC-customized GPU architecture to fulfill the goal of high-speed computation and defect capture rate that met production specifications. Combining with the ML model, proper detectors were designed for each specific feature, such as SRAF and curvy OPC design, and the performance of auto defect classification (ADC) with the model has been proven. By integrating all the work, it enabled the actinic tools to fulfill the requirement of massive production significantly.

Proceedings Article | 8 March 2016 Paper

Improving focus performance at litho using diffraction-based focus metrology, novel calibration methods, interface, and control loop

Jiarui Hu, Y. L. Chen, K. H. Chen, Brian Lee, Frankie Tsai, C. M. Ke, C. H. Liao, Desmond Ngo, Benny Gosali, Robin Tijssen, Vincent Huang, Ward Tu, Marc Noot, Maryana Escalante Marun, Christian Leewis, Carlo Luijten, Frank Staals, Martijn Van Veen, Francois Furthner, Stuart Young, Kaustuve Bhattacharyya

Proceedings Volume 9778, 977829 (2016) https://doi.org/10.1117/12.2220373

KEYWORDS: Metrology, Calibration, Scanners, Process control, Interfaces, Optical lithography, Semiconducting wafers, Photoresist materials, Finite element methods, Inspection, Data modeling, Diffraction

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Proceedings Article | 14 October 2011 Paper

Productivity of femtosecond DUV laser photomask repair in a real world mask house

Jin-Hong Lin, C. Chen, F. G. Tsai, Tod Robinson, Daniel Yi, Jeff LeClaire, Roy White, Ron Bozak, Mike Archuletta

Proceedings Volume 8166, 81662X (2011) https://doi.org/10.1117/12.898502

KEYWORDS: Photomasks, Deep ultraviolet, Opacity, Pellicles, Femtosecond phenomena, Quartz, Image transmission, Critical dimension metrology, Manufacturing, Chromium

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Proceedings Article | 4 November 2005 Paper

Improvement in defect classification efficiency by grouping disposition for reticle inspection

Rick Lai, Luke T. Hsu, Peter Chang, C.H. Ho, Frankie Tsai, Garrett Long, Paul Yu, John Miller, Vincent Hsu, Ellison Chen

Proceedings Volume 5992, 59920B (2005) https://doi.org/10.1117/12.632095

KEYWORDS: Photomasks, Inspection, Reticles, Diffractive optical elements, Manufacturing, Optical proximity correction, Semiconductor manufacturing, Lithography, Intelligence systems, Semiconducting wafers

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Proceedings Article | 17 December 2003 Paper

Effect of mask pattern fidelity on 193-nm lithography performance

Ching Cheng, Tsung-Lin Su, Fei-Geo Tsai, Tsong-Hsien Tsai, Chin-Chiang Tu, Chue-San Yoo

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.517829

KEYWORDS: Photomasks, Semiconducting wafers, Critical dimension metrology, Optical proximity correction, Lithography, Reticles, Resolution enhancement technologies, Dry etching, Mask making, Scanners

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Proceedings Article | 1 August 2002 Paper

CAR dry etching technology to produce 0.13 um reticle

W. Chou, Fei-Gwo Tsai, C. Tuo, Chue San Yoo, T. Tsai, Lawrence Shue

Proceedings Volume 4754, (2002) https://doi.org/10.1117/12.476951

KEYWORDS: Etching, Chromium, Dry etching, Reticles, Photomasks, Photoresist processing, Plasma, Manufacturing, Diffractive optical elements, Binary data

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Showing 5 of 10 publications

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