PROCEEDINGS VOLUME 4592
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND MEMS | 17-19 DECEMBER 2001
Device and Process Technologies for MEMS and Microelectronics II
IN THIS VOLUME

0 Sessions, 60 Papers, 0 Presentations
Materials  (7)
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND MEMS
17-19 December 2001
Adelaide, Australia
NanoFabrication
Proc. SPIE 4592, Micro stereo lithography and fabrication of 3D MEMS and their applications, 0000 (21 November 2001); doi: 10.1117/12.448953
Proc. SPIE 4592, Stereochemistry of carbon nanotubes for electronic applications, 0000 (21 November 2001); doi: 10.1117/12.448964
Proc. SPIE 4592, Single-crystal silicon nanostructure fabrication by scanning probe lithography and anisotropic wet etching, 0000 (21 November 2001); doi: 10.1117/12.448972
Proc. SPIE 4592, Smart dielectrics of fluorinated silicon glass prepared by liquid phase deposition method, 0000 (21 November 2001); doi: 10.1117/12.448980
Materials
Proc. SPIE 4592, MEMS materials characterization necessary for smart design and fabrication, 0000 (21 November 2001); doi: 10.1117/12.448988
Proc. SPIE 4592, III-V-semiconductor-based MOEMS devices for optical telecommunications, 0000 (21 November 2001); doi: 10.1117/12.448999
Proc. SPIE 4592, MEMS applications of porous silicon, 0000 (21 November 2001); doi: 10.1117/12.449009
Proc. SPIE 4592, Micromachining of TiNi shape memory alloy by excimer laser ablation, 0000 (21 November 2001); doi: 10.1117/12.449012
Proc. SPIE 4592, Fabrication of mechanical structures using macroporous silicon, 0000 (21 November 2001); doi: 10.1117/12.448954
Proc. SPIE 4592, Simple wet etching of GaN, 0000 (21 November 2001); doi: 10.1117/12.448955
Proc. SPIE 4592, Shape memory alloy actuators and their reliability, 0000 (21 November 2001); doi: 10.1117/12.448956
Fabrication Techniques
Proc. SPIE 4592, Fabrication of high-aspect-ratio precision MEMS with LIGA using synchrotron radiation, 0000 (21 November 2001); doi: 10.1117/12.448957
Proc. SPIE 4592, Development of a systematic recipe set for processing SU8-5 photoresist, 0000 (21 November 2001); doi: 10.1117/12.448958
Proc. SPIE 4592, Fabrication of refractive and diffractive plastic micro-optical components using microcompression molding, 0000 (21 November 2001); doi: 10.1117/12.448959
Proc. SPIE 4592, MEMS sensor packaging using LTCC substrate technology, 0000 (21 November 2001); doi: 10.1117/12.448960
Proc. SPIE 4592, Surface micromachining of uncooled infrared imaging array using anisotropic conductive film, 0000 (21 November 2001); doi: 10.1117/12.448961
Proc. SPIE 4592, Laser-LIGA for Serpentine Ni Microstructure, 0000 (21 November 2001); doi: 10.1117/12.448962
Proc. SPIE 4592, uEDM-produced mechanical grippers for handling and assembly in microtechnology, 0000 (21 November 2001); doi: 10.1117/12.448963
RF and Optical Applications
Proc. SPIE 4592, RFIC's challenges for third-generation wireless systems, 0000 (21 November 2001); doi: 10.1117/12.448965
Proc. SPIE 4592, Improving interconnect characteristics of thin film MEMS processes, 0000 (21 November 2001); doi: 10.1117/12.448966
Proc. SPIE 4592, Electromagnetic remote control and downscaling advantages and examples for MOEMS, 0000 (21 November 2001); doi: 10.1117/12.448967
Proc. SPIE 4592, Intelligent star tracker, 0000 (21 November 2001); doi: 10.1117/12.448968
Proc. SPIE 4592, Micro displacement sensing system and its application to micro magnetic bearings, 0000 (21 November 2001); doi: 10.1117/12.448969
Proc. SPIE 4592, Multiparameter integrated sensor development involving alternate materials, 0000 (21 November 2001); doi: 10.1117/12.448970
Systems and Characterization
Proc. SPIE 4592, Micronanosystems by bulk silicon micromachining, 0000 (21 November 2001); doi: 10.1117/12.448971
Proc. SPIE 4592, Microsystem tool for microsystem characterization profile measurement of high-aspect-ratio microstructures, 0000 (21 November 2001); doi: 10.1117/12.448973
Proc. SPIE 4592, Three-terminal test structure to measure stiction force using I-V data, 0000 (21 November 2001); doi: 10.1117/12.448974
Proc. SPIE 4592, Enabling MEMS technologies for communications systems, 0000 (21 November 2001); doi: 10.1117/12.448975
Proc. SPIE 4592, PZT stack etch for MEMS devices in a capacitively coupled high-density plasma reactor, 0000 (21 November 2001); doi: 10.1117/12.448976
Optical Applications
Proc. SPIE 4592, MEMS for optical networking: vast promises amid vaster promises, 0000 (21 November 2001); doi: 10.1117/12.448977
Proc. SPIE 4592, Si micromachining for optics: optical components and sensors, 0000 (21 November 2001); doi: 10.1117/12.448978
Proc. SPIE 4592, Integration of active materials with silicon micromachining: applications to optical MEMS, 0000 (21 November 2001); doi: 10.1117/12.448979
Proc. SPIE 4592, Antiresonant reflecting optical waveguide surface plasmon resonance sensors, 0000 (21 November 2001); doi: 10.1117/12.448981
Proc. SPIE 4592, 1D and 2D scanning mirrors using thermal buckle-beam actuation, 0000 (21 November 2001); doi: 10.1117/12.448982
Poster Session
Proc. SPIE 4592, Submicron high-aspect-ratio silicon beam etch, 0000 (21 November 2001); doi: 10.1117/12.448983
Proc. SPIE 4592, Materials and reliability issues in MEMS and microsystems, 0000 (21 November 2001); doi: 10.1117/12.448984
Proc. SPIE 4592, Thick resist for MEMS processing, 0000 (21 November 2001); doi: 10.1117/12.448985
Proc. SPIE 4592, Fabrication of integrated micromachined polymer magnet, 0000 (21 November 2001); doi: 10.1117/12.448986
Proc. SPIE 4592, Anodic alumina as a material for MEMS, 0000 (21 November 2001); doi: 10.1117/12.448987
Proc. SPIE 4592, Two-way shape memory NiTi sputter-deposited film fabrication, 0000 (21 November 2001); doi: 10.1117/12.448989
Proc. SPIE 4592, Processing compatibility of ZnO piezoelectric film with MEMS device, 0000 (21 November 2001); doi: 10.1117/12.448990
Proc. SPIE 4592, Fabrication method of 3D feed horn shape MEMS antenna array using MRPBI system and application for microbolometer, 0000 (21 November 2001); doi: 10.1117/12.448991
Proc. SPIE 4592, Enhanced performance of microbolometer using coupled feed horn antenna, 0000 (21 November 2001); doi: 10.1117/12.448992
Proc. SPIE 4592, Porous silicon as a sacrificial layer used in rf MEMS, 0000 (21 November 2001); doi: 10.1117/12.448993
Proc. SPIE 4592, Micro-machined tunable (Mi-T) VCSEL around 1.3 um, 0000 (21 November 2001); doi: 10.1117/12.448994
Proc. SPIE 4592, LIGA fabrication of high-aspect-ratio lobster-eye optics, 0000 (21 November 2001); doi: 10.1117/12.448995
Proc. SPIE 4592, Optical switch array based on microforming process, 0000 (21 November 2001); doi: 10.1117/12.448996
Proc. SPIE 4592, Copper microcoil arrays for the actuation of optical matrix microswitches, 0000 (21 November 2001); doi: 10.1117/12.448997
Proc. SPIE 4592, Bonding technologies for silicon scanning mirror having vertical comb fingers, 0000 (21 November 2001); doi: 10.1117/12.448998
Proc. SPIE 4592, Novel accelerometer on (111) substrate with differential electrode, 0000 (21 November 2001); doi: 10.1117/12.449000
Proc. SPIE 4592, Single-crystal silicon MEMS microactuator for high-density hard disk drive, 0000 (21 November 2001); doi: 10.1117/12.449001
Proc. SPIE 4592, MEMS-based precision motion control approach to high-throughput-rate electron beam lithography, 0000 (21 November 2001); doi: 10.1117/12.449002
Proc. SPIE 4592, Low-frequency process for silicon-on-insulator deep reactive ion etching, 0000 (21 November 2001); doi: 10.1117/12.449003
Proc. SPIE 4592, Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and vacuum metal casting, 0000 (21 November 2001); doi: 10.1117/12.449004
Proc. SPIE 4592, Excimer laser patterning of TiN film from metal sacrificial layers, 0000 (21 November 2001); doi: 10.1117/12.449005
Proc. SPIE 4592, Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA, 0000 (21 November 2001); doi: 10.1117/12.449006
Proc. SPIE 4592, Design and fabrication of a movable O-shape microclamper, 0000 (21 November 2001); doi: 10.1117/12.449007
Proc. SPIE 4592, Parameters study to improve sidewall roughness in advanced silicon etch process, 0000 (21 November 2001); doi: 10.1117/12.449008