Overcoming the challenges of 22-nm node patterning through litho-design co-optimization

Martin Burkhardt; J. C. Arnold; Z. Baum; S. Burns; J. Chang; J. Chen; J. Cho; V. Dai; Y. Deng; S. Halle; G. Han; S. Holmes; D. Horak; S. Kanakasabapathy; R. H. Kim; A. Klatchko; C. S. Koay; A. Krasnoperova; Y. Ma; E. McLellan; K. Petrillo; S. Schmitz; C. Tabery; Y. Yin; L. Zhuang; Y. Zou; J. Kye; V. Paruchuri; S. Mansfield; C. Spence; M. Colburn

doi:10.1117/12.814433

16 March 2009 Overcoming the challenges of 22-nm node patterning through litho-design co-optimization

Martin Burkhardt, J. C. Arnold, Z. Baum, S. Burns, J. Chang, J. Chen, J. Cho, V. Dai, Y. Deng, S. Halle, G. Han, S. Holmes, D. Horak, S. Kanakasabapathy, R. H. Kim, A. Klatchko, C. S. Koay, A. Krasnoperova, Y. Ma, E. McLellan, K. Petrillo, S. Schmitz, C. Tabery, Y. Yin, L. Zhuang, Y. Zou, J. Kye, V. Paruchuri, S. Mansfield, C. Spence, M. Colburn

Author Affiliations +

Proceedings Volume 7274, Optical Microlithography XXII; 727404 (2009) https://doi.org/10.1117/12.814433
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

Historically, lithographic scaling was driven by both improvements in wavelength and numerical aperture. Recently, the semiconductor industry completed the transition to 1.35NA immersion lithography. The industry is now focusing on double patterning techniques (DPT) as a means to circumvent the limitations of Rayleigh diffraction. Here, the IBM Alliance demonstrates the extendibility of several double patterning solutions that enable scaling of logic constructs by decoupling the pattern spatially through mask design or temporally through innovative processes. This paper details a set of solutions that have enabled early 22 nm learning through careful lithography-design optimization.

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Martin Burkhardt, J. C. Arnold, Z. Baum, S. Burns, J. Chang, J. Chen, J. Cho, V. Dai, Y. Deng, S. Halle, G. Han, S. Holmes, D. Horak, S. Kanakasabapathy, R. H. Kim, A. Klatchko, C. S. Koay, A. Krasnoperova, Y. Ma, E. McLellan, K. Petrillo, S. Schmitz, C. Tabery, Y. Yin, L. Zhuang, Y. Zou, J. Kye, V. Paruchuri, S. Mansfield, C. Spence, and M. Colburn "Overcoming the challenges of 22-nm node patterning through litho-design co-optimization", Proc. SPIE 7274, Optical Microlithography XXII, 727404 (16 March 2009); https://doi.org/10.1117/12.814433

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