PROCEEDINGS VOLUME 5346
MICROMACHINING AND MICROFABRICATION | 24-29 JANUARY 2004
MOEMS and Miniaturized Systems IV
MICROMACHINING AND MICROFABRICATION
24-29 January 2004
San Jose, California, United States
Sensors
Proc. SPIE 5346, Extrinsic Fabry-Perot pressure sensor using single deeply corrugated diaphragm technique, 0000 (24 January 2004); doi: 10.1117/12.516589
Proc. SPIE 5346, An SOS NEMS interferometer, 0000 (24 January 2004); doi: 10.1117/12.530909
Proc. SPIE 5346, A MEMS-based correlation radiometer, 0000 (24 January 2004); doi: 10.1117/12.536306
Proc. SPIE 5346, Nanocrystalline mesoporous SMO thin films prepared by sol gel process for MEMS-based hydrogen sensor, 0000 (24 January 2004); doi: 10.1117/12.524530
Processors
Proc. SPIE 5346, Measurement of a laterally deformable optical MEMS grating transducer, 0000 (24 January 2004); doi: 10.1117/12.532340
Proc. SPIE 5346, Microphotonic systems utilizing SU-8, 0000 (24 January 2004); doi: 10.1117/12.533352
Proc. SPIE 5346, Low power MOEMS components for active optical systems, 0000 (24 January 2004); doi: 10.1117/12.524917
Proc. SPIE 5346, Fabrication and optical packaging of an integrated Mach-Zehnder interferometer on top of a moveable micromirror, 0000 (24 January 2004); doi: 10.1117/12.524726
Proc. SPIE 5346, Artificial compound eyes: different concepts and their application for ultraflat image acquisition sensors, 0000 (24 January 2004); doi: 10.1117/12.530208
Proc. SPIE 5346, Optical MEMS at Silex Microsystems, 0000 (24 January 2004); doi: 10.1117/12.524705
Proc. SPIE 5346, MEMS tunable optical filter based on photonic crystal, 0000 (24 January 2004); doi: 10.1117/12.529237
Beam Steering and Switching
Proc. SPIE 5346, Micro-optical crossconnect switch, 0000 (24 January 2004); doi: 10.1117/12.521378
Proc. SPIE 5346, An optical switch using a replicated polymer optical waveguide, 0000 (24 January 2004); doi: 10.1117/12.525077
Proc. SPIE 5346, Optical switches for large-core-diameter optical fibers (POF and PCF), 0000 (24 January 2004); doi: 10.1117/12.532259
System Integration
Proc. SPIE 5346, Packaging and characterization of miniaturized spectral sensing devices, 0000 (24 January 2004); doi: 10.1117/12.530522
Proc. SPIE 5346, Modeling and simulation of fiber image guide multichip modules for MOEMS applications, 0000 (24 January 2004); doi: 10.1117/12.524853
Proc. SPIE 5346, Fabrication of out-of-plane SU-8 refractive microlens using direct lithography method, 0000 (24 January 2004); doi: 10.1117/12.530780
Proc. SPIE 5346, Packaging considerations for reliability of electrically controlled MEMS VOA, 0000 (24 January 2004); doi: 10.1117/12.524603
Keynote Paper
Proc. SPIE 5346, Industrial packaging and assembly infrastructure for MOEMS, 0000 (24 January 2004); doi: 10.1117/12.530257
Adaptive Optics (Joint Session With Conference 5348)
Proc. SPIE 5346, Low-voltage 256-electrode membrane mirror system for adaptive optics, 0000 (24 January 2004); doi: 10.1117/12.524486
Scanners (Joint Session With Conference 5348)
Proc. SPIE 5346, Electrostatic micromirror fabricated using CMP and anodic bonding, 0000 (24 January 2004); doi: 10.1117/12.524676
Proc. SPIE 5346, Closed-loop adaptive control for torsional micromirrors, 0000 (24 January 2004); doi: 10.1117/12.524691
Proc. SPIE 5346, Bulk micromachined quasistatic torsional micromirror, 0000 (24 January 2004); doi: 10.1117/12.530717
Back to Top