Martin Niehoff
Application Engineer at Siemens EDA
SPIE Involvement:
Publications (13)

Proceedings Article | 28 April 2023 Paper
Proceedings Volume 12495, 124951V (2023)
KEYWORDS: Data modeling, Semiconducting wafers, Metrology, Modeling, Machine learning, Fabrication, Data processing, Semiconductors, Process modeling, Deposition processes

Proceedings Article | 23 March 2011 Paper
Karsten Bubke, Matthias Ruhm, Rafael Aldana, Martin Niehoff, Xu Xie, Justin Ghan, Paul van Adrichem, Holger Bald, Paul Luehrmann, Stefan Roling, Rolf Seltmann
Proceedings Volume 7973, 79732E (2011)
KEYWORDS: Data modeling, Scanners, Scatterometry, Scanning electron microscopy, Metrology, Critical dimension metrology, Semiconducting wafers, Printing, Imaging systems, Cadmium

Proceedings Article | 4 March 2010 Paper
Proceedings Volume 7640, 764034 (2010)
KEYWORDS: Optical proximity correction, Photomasks, Lithography, Photovoltaics, Inspection, Manufacturing, Logic, 193nm lithography, Optical lithography, Reticles

Proceedings Article | 16 March 2009 Paper
Proceedings Volume 7274, 727439 (2009)
KEYWORDS: Photomasks, Optical proximity correction, Lithography, Resolution enhancement technologies, Manufacturing, Lithographic illumination, Semiconducting wafers, Logic, 193nm lithography, Silicon

Proceedings Article | 2 May 2008 Paper
S. Geisler, J. Bauer, U. Haak, U. Jagdhold, R. Pliquett, E. Matthus, R. Schrader, H. Wolf, U. Baetz, H. Beyer, M. Niehoff
Proceedings Volume 6792, 679210 (2008)
KEYWORDS: Optical proximity correction, Photomasks, Scanning electron microscopy, Metals, Transistors, Distortion, Critical dimension metrology, Etching, Lithography, Line edge roughness

Showing 5 of 13 publications
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