Dr. Byoung-Ho Lee Profile

Dr. Byoung-Ho Lee

Fellow at Hitachi High-Tech Corporation

SPIE Involvement:

Conference Program Committee | Author

Publications (23)

Proceedings Article | 22 February 2021 Poster + Presentation + Paper

Non-destructive depth measurement using SEM signal intensity

Jong-Hyun Seo, Changhwan Lee, Byoungho Lee, Ayumi Doi, Aoi Yamauchi, Daisuke Bizen, Makoto Suzuki

Proceedings Volume 11611, 116112Q (2021) https://doi.org/10.1117/12.2583623

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Proceedings Article | 24 March 2016 Paper

Study of correlation between overlay and displacement measured by Coherent Gradient Sensing (CGS) interferometry

Jeffrey Mileham, Yasushi Tanaka, Doug Anberg, David Owen, Byoung-Ho Lee, Eric Bouche

Proceedings Volume 9778, 97782W (2016) https://doi.org/10.1117/12.2220531

KEYWORDS: Overlay metrology, Lithography, Process control, Interferometry, Optical lithography, Semiconductors, Distortion, High volume manufacturing, Semiconducting wafers, Data modeling, Scanners

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Proceedings Article | 8 March 2016 Paper

Process tool monitoring and matching using interferometry technique

Doug Anberg, David Owen, Jeffrey Mileham, Byoung-Ho Lee, Eric Bouche

Proceedings Volume 9778, 977831 (2016) https://doi.org/10.1117/12.2220479

KEYWORDS: Interferometry, Semiconducting wafers, Process control, Semiconductors, Image processing, Control systems, Manufacturing, Defect inspection, Inspection, Overlay metrology, Scanners, Interferometers

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Proceedings Article | 10 April 2013 Paper

Optical analysis on the wafer defect inspection for yield enhancement

Jeongho Ahn, Byoungho Lee, Dong-Ryul Lee, Shijin Seong, Hyungseop Kim, Seongchae Choi, Heewon Sunwoo, Junbum Lee, Dongchul Ihm, Soobok Chin, Ho-Kyu Kang

Proceedings Volume 8681, 86811E (2013) https://doi.org/10.1117/12.2011387

KEYWORDS: Inspection, Finite-difference time-domain method, Semiconducting wafers, Defect inspection, Reflectivity, Numerical analysis, Wafer inspection, Thin films, Polarization, Multilayers

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Proceedings Article | 5 April 2012 Paper

Accelerating litho technology development for advanced design node flash memory FEOL by next-generation wafer inspection and SEM review platforms

Byoung Ho Lee, Jeongho Ahn, Dongchul Ihm, Soobok Chin, Dong-Ryul Lee, Seongchae Choi, Junbum Lee, Ho-Kyu Kang, Gangadharan Sivaraman, Tetsuya Yamamoto, Rahul Lakhawat, Ravikumar Sanapala, Chang Ho Lee, Arun Lobo

Proceedings Volume 8324, 832429 (2012) https://doi.org/10.1117/12.916505

KEYWORDS: Inspection, Scanning electron microscopy, Semiconducting wafers, Bridges, Front end of line, Defect detection, Wafer inspection, Defect inspection, Optical inspection, Particles

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Proceedings Article | 3 April 2012 Paper

Defect distribution study at through silicon via (TSV) bottom by scanning white-light interference microscopy

Jeongho Ahn, Jaeyoung Park, Dongchul Ihm, Byoungho Lee, Soobok Chin, Ho-Kyu Kang, Jiyoung Noh, Peter Ko, Timothy Johnson, Namki Suk

Proceedings Volume 8324, 83241U (2012) https://doi.org/10.1117/12.917797

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Microscopy, Silicon, Inspection, High volume manufacturing, Phase measurement, Electronics, Metrology, Process control

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Proceedings Article | 2 April 2010 Paper

After development inspection defectivity studies of an advanced memory device

Hyung-Seop Kim, Byoung-Ho Lee, Eric Ma, Fei Wang, Yan Zhao, Kenichi Kanai, Hong Xiao, Jack Jau

Proceedings Volume 7638, 76380L (2010) https://doi.org/10.1117/12.848066

KEYWORDS: Inspection, Critical dimension metrology, Reticles, Optical inspection, Semiconducting wafers, Defect inspection, Bridges, Wafer inspection, Finite element methods, Optical lithography

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Proceedings Article | 11 December 2009 Paper

After development inspection (ADI) studies of photo resist defectivity of an advanced memory device

Hyung-Seop Kim, Yong Min Cho, Byoung-Ho Lee, Roland Yeh, Eric Ma, Fei Wang, Yan Zhao, Kenichi Kanai, Hong Xiao, Jack Jau

Proceedings Volume 7520, 75200J (2009) https://doi.org/10.1117/12.837103

KEYWORDS: Inspection, Reticles, Semiconducting wafers, Optical inspection, Bridges, Wafer inspection, Defect inspection, Finite element methods, Scanning electron microscopy, Optical lithography

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Proceedings Article | 24 March 2009 Paper

Development of a novel methodology for effective partial die inspection and monitoring

Byoung-Ho Lee, Tae-Yong Lee, Andrew Cross, Masami Aoki, HeungSoo Choi, YeonHo Pae

Proceedings Volume 7272, 72723K (2009) https://doi.org/10.1117/12.813994

KEYWORDS: Inspection, Semiconducting wafers, Yield improvement, Defect inspection, Wafer inspection, Reticles, Signal processing, Electronics, Semiconductors, Contamination

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Proceedings Article | 16 April 2008 Paper

AWV: high-throughput cross-array cross-wafer variation mapping

Jeong-Ho Yeo, Byoung-Ho Lee, Tae-Yong Lee, Gadi Greenberg, Doron Meshulach, Erez Ravid, Shimon Levi, Kobi Kan, Saar Shabtay, Yehuda Cohen, Ofer Rotlevi

Proceedings Volume 6922, 69221S (2008) https://doi.org/10.1117/12.772402

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Finite element methods, Polarization, Inspection, Deep ultraviolet, Reflectivity, Wafer inspection, Etching, Computer simulations

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Proceedings Article | 25 March 2008 Paper

Effect of setpoint on CD measurement in CD-AFM: plausibility study

B. C. Park, J. Choi, S. J. Ahn, M-j Shin, D-c Ihm, B-h Lee

Proceedings Volume 6922, 69222H (2008) https://doi.org/10.1117/12.773230

KEYWORDS: Calibration, Metrology, Critical dimension metrology, Liquids, Atomic force microscopy, Feedback loops, Near field scanning optical microscopy, Humidity, Error analysis, Solids

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Proceedings Article | 5 April 2007 Paper

Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools

Byoung-Ho Lee, Jin-Seo Choi, Soo-Bok Chin, Do-Hyun Cho, Chang-Lyong Song

Proceedings Volume 6518, 651847 (2007) https://doi.org/10.1117/12.710746

KEYWORDS: Wafer inspection, Wafer-level optics, Defect detection, Signal detection, Inspection, Electrons, Silicon, Virtual colonoscopy, Semiconducting wafers, Etching

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Proceedings Article | 24 March 2006 Paper

Study of critical dimension and overlay measurement methodology using SEM image analysis for process control

Tae Yong Lee, Byoung Ho Lee, Soo Bok Chin, Young Sun Cho, Jun Sik Hong, Jong Seo Hong, Chang Lyong Song

Proceedings Volume 6152, 61522E (2006) https://doi.org/10.1117/12.656736

KEYWORDS: Semiconducting wafers, Wafer-level optics, Overlay metrology, Scanning electron microscopy, Process control, Image processing, Semiconductors, Lithography, Optical testing, Metrology

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Proceedings Article | 24 March 2006 Paper

Polarization control for enhanced defect detection on advanced memory devices

Byoung-Ho Lee, Dong-Chul Ihm, Jeong-Ho Yeo, Yael Gluk, Doron Meshulach

Proceedings Volume 6152, 61521Q (2006) https://doi.org/10.1117/12.656004

KEYWORDS: Signal to noise ratio, Polarization, Defect detection, Polarization control, Bridges, Wafer-level optics, Inspection, Deep ultraviolet, Semiconducting wafers, Dielectric polarization

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