PROCEEDINGS VOLUME 5343
MICROMACHINING AND MICROFABRICATION | 24-29 JANUARY 2004
Reliability, Testing, and Characterization of MEMS/MOEMS III
MICROMACHINING AND MICROFABRICATION
24-29 January 2004
San Jose, California, United States
Keynote Presentation
Proc. SPIE 5343, The reliability of RF-MEMS: failure modes, test procedures, and instrumentation, 0000 (23 December 2003); doi: 10.1117/12.532335
Device Reliability
Proc. SPIE 5343, Lifetime characteristics of ohmic MEMS switches, 0000 (23 December 2003); doi: 10.1117/12.522759
Proc. SPIE 5343, Electrothermal actuator reliability studies, 0000 (23 December 2003); doi: 10.1117/12.530936
Proc. SPIE 5343, Reliability issues of an accelerometer under environmental stresses, 0000 (23 December 2003); doi: 10.1117/12.524575
Proc. SPIE 5343, Improvement in reliability of MEMS resonator using multi-layers, 0000 (23 December 2003); doi: 10.1117/12.524442
MEMS/MOEMS Analysis Techniques I
Proc. SPIE 5343, MEMS/MOEMS failure location and characterization methods: the micromirror device, 0000 (23 December 2003); doi: 10.1117/12.524104
Proc. SPIE 5343, MEMS characterization using new hybrid laser Doppler vibrometer/strobe video system, 0000 (23 December 2003); doi: 10.1117/12.524565
Proc. SPIE 5343, Novel low coherence metrology for nondestructive characterization of high aspect ratio micro-fabricated and micro-machined structures, 0000 (23 December 2003); doi: 10.1117/12.530749
Proc. SPIE 5343, Multifunctional interferometric platform for on-chip testing of the micromechanical properties of MEMS/MOEMS, 0000 (23 December 2003); doi: 10.1117/12.524324
MEMS/MOEMS Packaging Reliability and Techniques
Proc. SPIE 5343, Reliable vacuum packaging using NanoGetters and glass frit bonding, 0000 (23 December 2003); doi: 10.1117/12.530414
Proc. SPIE 5343, Reliability study of wafer bonding for micro-electro-mechanical systems, 0000 (23 December 2003); doi: 10.1117/12.524934
Proc. SPIE 5343, Chemical treatment of getter films on wafers prior to vacuum packaging, 0000 (23 December 2003); doi: 10.1117/12.525099
Proc. SPIE 5343, Wafer-level-scale package of MEMS device by eutectic bonding method, 0000 (23 December 2003); doi: 10.1117/12.522834
Assembly and Fabrication Reliability
Proc. SPIE 5343, Assembly process issues and reliability in microsystem packaging, 0000 (23 December 2003); doi: 10.1117/12.531901
Proc. SPIE 5343, Reliable bonding using indium-based solders, 0000 (23 December 2003); doi: 10.1117/12.524823
Proc. SPIE 5343, e-Manufacturing software helps electronic manufacturers meet changing demand, 0000 (23 December 2003); doi: 10.1117/12.529601
Proc. SPIE 5343, Investigation of improving MEMS-type VOA reliability, 0000 (23 December 2003); doi: 10.1117/12.524609
MEMS/MOEMS Material Properties
Proc. SPIE 5343, Reaction-layer fatigue: understanding the limitations of structural silicon, 0000 (23 December 2003); doi: 10.1117/12.527465
Proc. SPIE 5343, Factors affecting silicon membrane burst strength, 0000 (23 December 2003); doi: 10.1117/12.524648
Proc. SPIE 5343, Stress relaxation in nanoscale aluminum films, 0000 (23 December 2003); doi: 10.1117/12.529632
Proc. SPIE 5343, Creep and stress relaxation in bilayer Au/Si microcantilevers, 0000 (23 December 2003); doi: 10.1117/12.531693
Proc. SPIE 5343, Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror, 0000 (23 December 2003); doi: 10.1117/12.524872
MEMS/MOEMS Surface Characterization
Proc. SPIE 5343, Unified characterization of surfaces and gases in MEMS devices, 0000 (23 December 2003); doi: 10.1117/12.524777
Proc. SPIE 5343, Micro/nanoscale tribological and mechanical characterization for MEMS/NEMS, 0000 (23 December 2003); doi: 10.1117/12.531849
Proc. SPIE 5343, Defects and friction in alkylsilane self-assembled monolayers, 0000 (23 December 2003); doi: 10.1117/12.524562
Proc. SPIE 5343, Investigation of adhesion during operation of MEMS cantilevers, 0000 (23 December 2003); doi: 10.1117/12.532891
MEMS/MOEMS Analysis Techniques
Proc. SPIE 5343, Field emission testing of carbon nanotubes for THz frequency vacuum microtube sources, 0000 (23 December 2003); doi: 10.1117/12.531403
Proc. SPIE 5343, Testing silicon MEMS structures subjected to thermal loading by digital holography, 0000 (23 December 2003); doi: 10.1117/12.524441
Proc. SPIE 5343, A new sensor for trench depth monitoring: the TDM 200, 0000 (23 December 2003); doi: 10.1117/12.529023
Proc. SPIE 5343, Innovative metrology method for the 3-dimensional measurement of MEMS structures, 0000 (23 December 2003); doi: 10.1117/12.524395
Device Characterization and Testing
Proc. SPIE 5343, MEMS process error characterization using lateral resonant structures, 0000 (23 December 2003); doi: 10.1117/12.524236
Proc. SPIE 5343, Fabrication and characterization of high Q microresonators using thin plate mechanical mode, 0000 (23 December 2003); doi: 10.1117/12.524751
Proc. SPIE 5343, Automated full-field interferometric characterization of micromachined silicon membrane, 0000 (23 December 2003); doi: 10.1117/12.524977
Proc. SPIE 5343, The temperature compensation of the silicon piezo-resistive pressure sensor using the half-bridge technique, 0000 (23 December 2003); doi: 10.1117/12.527387
Poster Session
Proc. SPIE 5343, Planar distortion quantification to evaluate PDMS stamps affixed on glass support, 0000 (23 December 2003); doi: 10.1117/12.523899
Back to Top