PROCEEDINGS VOLUME 3665
15TH EUROPEAN CONFERENCE ON MASK TECHNOLOGY FOR INTEGRATED CIRCUITS AND MICRO-COMPONENTS | 16-17 NOVEMBER 1998
15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98
IN THIS VOLUME

0 Sessions, 24 Papers, 0 Presentations
Session 1  (24)
15TH EUROPEAN CONFERENCE ON MASK TECHNOLOGY FOR INTEGRATED CIRCUITS AND MICRO-COMPONENTS
16-17 November 1998
Munich, Germany
Session 1
Proc. SPIE 3665, Future reticle demand and next-generation lithography technologies, 0000 (23 April 1999); doi: 10.1117/12.346206
Proc. SPIE 3665, HOYA deep-UV EAPSM blanks development status, 0000 (23 April 1999); doi: 10.1117/12.346216
Proc. SPIE 3665, Overview of SCALPEL mask technology, 0000 (23 April 1999); doi: 10.1117/12.346223
Proc. SPIE 3665, PN and SOI wafer flow process for stencil mask fabrication, 0000 (23 April 1999); doi: 10.1117/12.346224
Proc. SPIE 3665, Use of KLA-Tencor STARlight SL 300 for in-process contamination inspection to control reticle defect densities, 0000 (23 April 1999); doi: 10.1117/12.346226
Proc. SPIE 3665, Development of a new defect sensitivity monitor for advanced OPC reticle technology, 0000 (23 April 1999); doi: 10.1117/12.346227
Proc. SPIE 3665, Inspecting the new generation of reticles using UV imaging, 0000 (23 April 1999); doi: 10.1117/12.346228
Proc. SPIE 3665, Initial results from a Leica ZBA31H+ shaped E-beam mask writer located at the Photronics Advanced Mask Shop in Manchester, England, 0000 (23 April 1999); doi: 10.1117/12.346229
Proc. SPIE 3665, Ion projection lithography for IC manufacturing, 0000 (23 April 1999); doi: 10.1117/12.346207
Proc. SPIE 3665, Results from submicron CD metrology obtained with new I-line tools, 0000 (23 April 1999); doi: 10.1117/12.346208
Proc. SPIE 3665, Pattern placement metrology tool matching within DPI's sites, 0000 (23 April 1999); doi: 10.1117/12.346209
Proc. SPIE 3665, Development of an algorithm for monitoring pattern fidelity on photomasks for 0.2-um technology and beyond based on light optical CD metrology tools, 0000 (23 April 1999); doi: 10.1117/12.346210
Proc. SPIE 3665, Effective multisite CD correlation to maximize high-end tool utilization, 0000 (23 April 1999); doi: 10.1117/12.346211
Proc. SPIE 3665, Overlay mapping of microlithographic pattern generators by means of grouped structures, 0000 (23 April 1999); doi: 10.1117/12.346212
Proc. SPIE 3665, Determination of residual stress and elastic constants of silicon open stencil masks for ion projection lithography, 0000 (23 April 1999); doi: 10.1117/12.346213
Proc. SPIE 3665, Pellicle-induced reticle distortion: an experimental investigation, 0000 (23 April 1999); doi: 10.1117/12.346214
Proc. SPIE 3665, Manufacturing an advanced process characterization reticle incorporating halftone biasing, 0000 (23 April 1999); doi: 10.1117/12.346215
Proc. SPIE 3665, Hierarchical mask data preparation and special fracturing techniques in MGS, 0000 (23 April 1999); doi: 10.1117/12.346217
Proc. SPIE 3665, Geometrical E-beam proximity correction for raster scan systems, 0000 (23 April 1999); doi: 10.1117/12.346218
Proc. SPIE 3665, Characterization of inspection sensitivity on advanced OPC reticles, 0000 (23 April 1999); doi: 10.1117/12.346219
Proc. SPIE 3665, Development of an inductively coupled plasma etching system for 230-mm reticles, 0000 (23 April 1999); doi: 10.1117/12.346220
Proc. SPIE 3665, Experience with EFQM assessment at Siemens Mask Shop, 0000 (23 April 1999); doi: 10.1117/12.346221
Proc. SPIE 3665, Investigation of lithography performance using multipass gray (MPG) with MEBES 5000, 0000 (23 April 1999); doi: 10.1117/12.346222
Back to Top