Dr. Isabelle Servin
at CEA-LETI
SPIE Involvement:
Author
Publications (25)

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Lithography, Electron beam lithography, Etching, Metals, Copper, Scanning electron microscopy, Optical alignment, Semiconducting wafers, System on a chip, Back end of line

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Electron beam lithography, Electron beams, Line width roughness, Optical alignment, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | April 27, 2017
Proc. SPIE. 10144, Emerging Patterning Technologies
KEYWORDS: Wafer-level optics, Lithography, Electron beam lithography, Electron beams, Switching, Lithographic illumination, Photomasks, Integrated optics, Optical alignment, Semiconducting wafers

PROCEEDINGS ARTICLE | April 10, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Lithography, Electron beam lithography, Etching, Line width roughness, Directed self assembly, Nanoimprint lithography, Critical dimension metrology, Photoresist processing, Semiconducting wafers, System on a chip

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Optical lithography, Polymers, Annealing, Oxygen, Scanning electron microscopy, Line width roughness, Directed self assembly, Thin film coatings, Semiconducting wafers, Atmospheric modeling

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Optical lithography, Polymers, Glasses, Ultraviolet radiation, Annealing, Silicon, Scanning electron microscopy, Line width roughness, Directed self assembly, Semiconducting wafers

Showing 5 of 25 publications
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